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Increasing the Heat Flow of Flexible Cellular Foam Through the Incorporation of Highly Thermally Conductive Solids

a polyurethane foam and solids technology, applied in the field of incorporating highly thermally conductive solids in polyurethane foam polymer matrix, can solve the problems of prior patents not teaching the addition of highly thermally conductive solids to flexible polyurethane, high density memory foam has the tendency to “sleep hotter”,

Inactive Publication Date: 2014-07-03
PETERSON CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent is about methods of making flexible foam with highly thermally-conductive solids, which can be used in bedding and seating articles. The foam is made by adding a combination of flexible polyurethane foam or polyester foam and highly thermally-conductive solids, such as silicon carbide, diamond crystal powder, or boron nitride. The foam can be cut or molded into various shapes, and can also be combined with other substrates like flexible polyurethane foam or latex foam to create products like mattresses, pillows, or cushioning products. The technical effect of this patent is that it provides a way to create flexible foam with improved heat conduction, which can improve the performance and comfort of bedding and seating articles.

Problems solved by technology

High density polyurethane foams have a tendency to trap heat and slowly diffuse heat through conduction and convection.
In particular, high density memory foam has the tendency to “sleep hotter” than traditional flexible foam, due to reduced open void space within the foam.
Prior patents do not teach adding highly thermally conductive solids to flexible polyurethane foam to increase the foam thermal conductivity and using said increased thermally conductive flexible polyurethane foam as one or more layers in a mattress or seating article.

Method used

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  • Increasing the Heat Flow of Flexible Cellular Foam Through the Incorporation of Highly Thermally Conductive Solids
  • Increasing the Heat Flow of Flexible Cellular Foam Through the Incorporation of Highly Thermally Conductive Solids
  • Increasing the Heat Flow of Flexible Cellular Foam Through the Incorporation of Highly Thermally Conductive Solids

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[0047]A two component system was obtained from Peterson Chemical Technology. The system consisted of a “B” side (PCT-8205B) containing polyols, water, silicone surfactant, gelation catalyst and blowing catalyst, and the “A” side (PCT-8205A) which consisted of an isocyanate compound. Foam sample 1 is the foam control sample that does not contain HTCS particles, and foam sample 2 is a polyurethane foam produced from the two component system with addition of silicon carbide to obtain a final concentration of 17.5% by weight based on the final foam net weight after gas loss.

[0048]Table 1 shows the physical properties of foam samples 1 and 2. The densities, IFDs and airflows were measured according to ASTM D3574. The thermal conductivity was measured according to ASTM E1225 test method with a 75% compression on the foam sample. The results show a 15.8% improvement in thermal conductivity by incorporating 17.5 wt % silicon carbide in the polyurethane foam components before reacting into a...

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Abstract

Methods and combinations of mattress support surfaces comprising one or more flexible polyurethane foam layers containing highly thermally-conductive solids, such as diamond or silicon carbide, and said layer combination is capable of transferring heat from a warm surface, such as a person sleeping on a bed, to a cooler region at a faster rate throughout the mattress than the thermal dissipation rate obtained from flexible polyurethane foam without highly thermally-conductive solids.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application claims the benefit of U.S. Provisional Patent Application No. 61 / 746,369 filed Dec. 27, 2012, incorporated herein by reference in its entirety.TECHNICAL FIELD[0002]This invention relates to incorporating highly thermally-conductive solids in a polyurethane foam polymer matrix, wherein said combination is used in bedding and seating articles, and more particularly this invention relates to articles that transfer heat from a warm surface, such as a person sleeping on a bed, to a cooler region at a faster rate than the heat dissipation rate obtained from flexible polyurethane foam without highly thermally conductive solids incorporated therein.TECHNICAL BACKGROUND[0003]Typically, high density flexible polyurethane foams have low thermal conductivities in the range of 0.02-0.04 W / (m-° K) in an uncompressed state. High density polyurethane foams have a tendency to trap heat and slowly diffuse heat through conduction and convect...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): A47G9/10A47C27/14C09K5/14
CPCA47G9/10A47C27/15A47G2009/1018C09K5/14A47C27/14A47C21/046
Inventor PETERSON, BRUCE W.GIORI, GUALTIERO G.CRAWFORD, MARK L.
Owner PETERSON CHEM TECH