Increasing the Heat Flow of Flexible Cellular Foam Through the Incorporation of Highly Thermally Conductive Solids
a polyurethane foam and solids technology, applied in the field of incorporating highly thermally conductive solids in polyurethane foam polymer matrix, can solve the problems of prior patents not teaching the addition of highly thermally conductive solids to flexible polyurethane, high density memory foam has the tendency to “sleep hotter”,
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[0047]A two component system was obtained from Peterson Chemical Technology. The system consisted of a “B” side (PCT-8205B) containing polyols, water, silicone surfactant, gelation catalyst and blowing catalyst, and the “A” side (PCT-8205A) which consisted of an isocyanate compound. Foam sample 1 is the foam control sample that does not contain HTCS particles, and foam sample 2 is a polyurethane foam produced from the two component system with addition of silicon carbide to obtain a final concentration of 17.5% by weight based on the final foam net weight after gas loss.
[0048]Table 1 shows the physical properties of foam samples 1 and 2. The densities, IFDs and airflows were measured according to ASTM D3574. The thermal conductivity was measured according to ASTM E1225 test method with a 75% compression on the foam sample. The results show a 15.8% improvement in thermal conductivity by incorporating 17.5 wt % silicon carbide in the polyurethane foam components before reacting into a...
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