Building board and method for producing building board

Abstract

A building board includes an inorganic board having a surface covered by an insulating coating film containing a coating film forming material and organic hollow particles, wherein the organic hollow particles have an average particle size in the range of 5 to 50 μm and an average hollow ratio of 80% or more, and the insulating coating film contains 0 01 to 5.0 parts by mass of the organic hollow particles per 100 parts by mass of solid content thereof, and has an average thickness of 5 to 500 μm. The method for producing a building board includes: applying, onto a surface of an inorganic board, an insulating coating material containing a coating film forming material and organic hollow particles; and drying the insulating coating material to form an insulating coating film.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a building board that is suitable for wall materials, roof materials and the like, and a method for producing such a building board.[0003]2. Description of Related Art[0004]Conventionally, inorganic boards composed mainly of a hydraulic inorganic powder such as cement and wood reinforcement such as wood pulp fiber have been used. These inorganic boards have excellent physical properties including, for example, flexural strength, and thus are used as building boards such as interior wall materials, exterior wall materials, roof materials and the like of residential houses after they are subjected to coating.[0005]However, in view of the recent environmental issues, including, for example, those related to energy saving, there is a need for an improved thermal insulation effect for residential houses. To this end, investigations have been made to increase the thermal insulation effect for ...

AI Technical Summary

Benefits of technology

The present invention provides a building board with excellent thermal insulation properties and design quality. It includes an inorganic board covered by an insulating coating film containing organic hollow particles. The organic hollow particles are distributed throughout the coating film and are responsible for its high thermal insulation properties. The coating film is formed using various resins and can be easily applied to the inorganic board using a water-soluble solvent. The resulting building board is suitable for use in building construction and meets industry standards for thermal insulation.

Problems solved by technology

As a result of in-depth studies carried out by the inventors, it has been found that one of the causes lies in that the ceramic fine powder tends not to provide a thermal insulation effect because its hollow ratio is prone to be low.

Additionally, the ceramic fine powder has a large particle size, and thus the surface of a coating film formed therefrom has no smoothness, resulting in a poor appearance in terms of design quality.