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Method of manufacturing wiring substrate having built-in component

a technology of built-in components and wiring substrates, which is applied in the direction of printed circuit manufacturing, printed circuit aspects, cross-talk/noise/interference reduction, etc., can solve the problems of difficulty in bonding ic chips directly onto motherboards, and achieve the effect of improving the dimensional accuracy of component-built-in wiring substrates

Inactive Publication Date: 2015-06-25
NGK SPARK PLUG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a method of manufacturing a component-built-in wiring substrate that exhibits excellent reliability. This is achieved by improving adhesion between a resin filler and a core substrate. The leveling step involves abrading the resin filler to ensure even surface contact between the resin filler and the plating layer formed on the core main-surface. This can be done either mechanically or chemically, with the method of mechanically removing a portion of the resin filler being preferred as it is cost-effective and easy to perform.

Problems solved by technology

However, since the terminals of the IC chip differ greatly in pitch from those of the motherboard, difficulty is encountered in bonding the IC chip directly onto the motherboard.

Method used

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  • Method of manufacturing wiring substrate having built-in component
  • Method of manufacturing wiring substrate having built-in component
  • Method of manufacturing wiring substrate having built-in component

Examples

Experimental program
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first embodiment

[0058]A component-built-in wiring substrate according to the present invention will next be described in detail with reference to the drawings.

[0059]As shown in FIG. 1, a component-built-in wiring substrate (hereinafter, referred to as the “wiring substrate”) 10 of the present embodiment is a wiring substrate for mounting an IC chip thereon. The wiring substrate 10 includes a substantially square, plate-like core substrate 11; a main-surface-side build-up layer 31 (a wiring laminate) formed on a core main-surface 12 (the upper surface in FIG. 1) of the core substrate 11; and a back-surface-side build-up layer 32 (a laminate) formed on a core back-surface 13 (the lower surface in FIG. 1) of the core substrate 11.

[0060]The core substrate 11 of the present embodiment has a substantially square shape as viewed in plane, measuring 25 mm length×25 mm width×0.4 mm thickness. The core substrate 11 is formed from a thermosetting resin (e.g., epoxy resin) and has a thermal expansion coefficie...

second embodiment

[0104]In the above-described second embodiment, in the covering step, the opening of the accommodation hole 390 on the side toward the core main-surface 312 is covered with the cover member 301; in the first filling step, the filling material 302 is filled into the through-holes 314; and in the second filling step, a portion of the insulation layer 395 is charged into the accommodation hole 390. However, the following procedure may be employed: in the covering step, the openings of the through-holes 314 on the side toward the core main-surface 312 are covered with the cover member 301; in the first filling step, the filling material 302 is filled into the accommodation hole 390; and in the second filling step, a portion of the insulation layer 395 is charged into the through-holes 314.

[0105]In the above-described embodiments, the via-array-type ceramic capacitors 101 and 304 are used as components to be accommodated in the accommodation holes 90 and 390, respectively. However, as sh...

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Abstract

A method of manufacturing a component-built-in wiring substrate which exhibits excellent reliability, through improvement of adhesion between a resin filler and a core substrate, is provided. In some embodiments the method comprises a core substrate preparation step for preparing a core substrate, an accommodation-hole forming step for forming an accommodation hole in the core substrate, and a through-hole forming step for forming through-holes. In a plating-layer forming step, a plating layer is formed on an inner wall surface of the accommodation hole and plating layers are formed on the inner wall surfaces of the through-holes, which become through-hole conductors each having a hollow. In an accommodation step, a component is accommodated in the accommodation hole. In a resin charging step, a resin filler is filled into a gap between component side-surfaces and the inner wall surface of the accommodation hole and into the hollows.

Description

CROSS REFERENCE TO RELATED APPLICATIONS[0001]The present application is a divisional of prior U.S. application Ser. No. 13 / 626,477, filed Sep. 25, 2012, and claims priority to Japanese Patent Application No. 2011-212967, which was filed on Sep. 28, 2011, the disclosures of which is herein incorporated by reference in their entirety.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a method of manufacturing a wiring substrate having a built-in component (hereinafter referred to as a “component-built-in wiring substrate”) in which a component, such as a capacitor, is incorporated.[0004]2. Description of Related Art[0005]In association with a recent increasing tendency toward higher operation speed and higher functionality of semiconductor integrated circuit devices (IC chips) used as, for example, microprocessors of computers, the number of terminals have increased and the pitch between the terminals has tended to become narrower. General...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H05K3/30H05K3/00
CPCH05K3/0094H05K3/306H01L2224/16225H01L2924/1461H01L2924/1531H05K1/0218H05K1/0222H05K1/185H05K3/4602H05K2201/0187H05K2201/09536H05K2201/0959H05K2201/09981H05K2201/10712H05K2203/1394Y10T29/49133Y10T29/49135H01L2924/00H05K3/46
Inventor SUZUKI, KENJI
Owner NGK SPARK PLUG CO LTD