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Sliding member

a sliding member and mating technology, applied in the field of sliding members, can solve the problems of reduced strength and hardness, to the base side, and inability to easily dissipate the heat generated in the sliding part with a mating member, and achieve the effect of high seizure resistan

Inactive Publication Date: 2015-10-15
DAIDO METAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a sliding member with an Ag-based overlay layer that has high seizure resistance even when using Pb is avoided. The overlay layer is relatively soft and has excellent thermal conductivity, allowing for rapid dissipation of frictional heat to the base side. The addition of Al to the overlay layer does not significantly reduce its thermal conductivity, and the layer can function even under severer conditions. The overlay layer can also contain other additive elements such as Sn and Zn, and the thermal conductivity of the layer comes close to that of Al when the proportion of Al exceeds 15% by mass.

Problems solved by technology

Therefore, an overlay layer which comprises Ag as a main component and to which In, Sn, or Bi is added cannot easily dissipate the heat generated in the sliding part with a mating member, to the base side.
As a result, the temperature of an overlay layer of this type easily rises under severer conditions, causing reduction in strength and hardness, which causes a problem of easily resulting in seizure.

Method used

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Embodiment Construction

[0015]Hereinafter, a specific embodiment of a sliding member will be described.

[0016]First, the procedures for producing a sliding member to be used as a sample in the present embodiment will be described.

[0017]As shown in FIG. 1, a sliding member 10 comprises a base 11 and an overlay layer 12. The base 11 has a back plate layer 13 and a Cu-based or Al-based bearing alloy layer 14. The back plate layer 13 is formed from steel. Thus, the base 11 is a so-called bimetal comprising the steel back plate layer 13 and the Cu-based or Al-based bearing alloy layer 14. The base 11 formed from the back plate layer 13 and the bearing alloy layer 14 is shaped into a semicylindrical or cylindrical shape. The surface of the shaped base 11 on the side of the bearing alloy layer 14 is subjected to surface machining such as boring. The surface of the base 11 subjected to surface machining is washed by electrolytic degreasing and with acid. Thus, after the surface of the base 11 is washed, an Ag-based...

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Abstract

Provided is a sliding member which has high seizure resistance though an overlay layer comprising Ag as the main component is used therein. The sliding member of an embodiment comprises a base and an overlay layer which is disposed on the sliding-side surface of the base and which comprises Ag as the main component and contains Al. The overlay layer comprising Ag as the main component is relatively soft. Due to this, the overlay layer comprising Ag as the main component can ensure high seizure resistance even when the use of Pb is avoided. Furthermore, the overlay layer comprising Ag as the main component has excellent thermal conductivity. Due to this, frictional heat generating at the sliding part rapidly dissipates to the base side.

Description

TECHNICAL FIELD[0001]The present invention relates to a sliding member.BACKGROUND ART[0002]Conventionally, a sliding member of a slide bearing for an internal-combustion engine etc. comprises an overlay layer on a sliding-side surface of a base such as a steel back plate. For such an overlay layer, there is proposed an overlay layer which comprises Ag as a main component and to which In, Sn, Bi, or the like is added, in order to obtain sliding characteristics to the same degree as those of a sliding member containing Pb, while avoiding the use of Pb (Patent Literature 1).[0003]However, although In, Sn, and Bi are softer than Ag, their thermal conductivities are extremely smaller than that of Ag. Therefore, an overlay layer which comprises Ag as a main component and to which In, Sn, or Bi is added cannot easily dissipate the heat generated in the sliding part with a mating member, to the base side. As a result, the temperature of an overlay layer of this type easily rises under sever...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C10M125/04
CPCC10M125/04C22C5/06B32B15/018F16C33/124F16C2204/20F16C9/00F16C2204/04F16C17/022F16C17/00
Inventor YASUI, MIKIHITOASAKURA, HIROYUKIHANEDA, SHIGEYA
Owner DAIDO METAL CO LTD
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