Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for manufacturing microphone chip

a manufacturing method and microphone technology, applied in the direction of transducer diaphragms, semiconductor electrostatic transducers, loudspeakers, etc., can solve the problems of hard to control the stress of diaphragm and back plate, and difficult to improve sensitivity and consistency

Active Publication Date: 2017-06-08
AAC TECH PTE LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent describes a method of combining two layers of oxide on a microphone chip to reduce stress and impact from external factors. This method also allows for adjusting the stress of the component layer for different products without needing additional plasma processing. The technical effect is to create a more robust and reliable microphone chip.

Problems solved by technology

So far, in all the methods of manufacturing the microphone based on the semi-conductor material, polycrystalline silicon is deposited on the substrate to form the diaphragm and back plate, due to the deposit of multi-layer structure, the processes including the high temperature bonding etc. make it hard to control the stress of the diaphragm and back plate, it is very hard to improve its sensitivity and consistency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing microphone chip
  • Method for manufacturing microphone chip
  • Method for manufacturing microphone chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017]The present invention will hereinafter be described in detail with reference to an exemplary embodiment. To make the technical problems to be solved, technical solutions and beneficial effects of present disclosure more apparent, the present disclosure is described in further detail together with the figures and the embodiment. It should be understood the specific embodiment described hereby is only to explain this disclosure, not intended to limit this disclosure.

[0018]Referring to FIG. 10, a microphone chip related to an exemplary embodiment of the present disclosure includes a diaphragm 300, a back plate 700 with a certain distance away from the diaphragm 300, a bonding layer 400 clamped between the diaphragm 300 and the back plate 700, and an anti-stick protrusion 500 formed on the back plate 700.

[0019]A method for manufacturing the microphone chip includes the following steps:

[0020]Step I (S1): as shown in FIG. 1, providing a first underlay 1 including a first surface 11 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for manufacturing a microphone chip, includes steps of: providing a first underlay, and depositing insulating oxide layers at both sides; depositing the component layers on the insulating oxide layers respectively; depositing the tetraethyl orthosilicate oxide layers on the component layers; etching the tetraethyl orthosilicate oxide layers; patterning various deposition layers in the first underlay; providing the second underlay; depositing the oxide layers on the substrate; etching and patterning oxide layer; releasing the back plate; combining the first underlay and the second underlay by welding the tetraethyl orthosilicate oxide layer on the first underlay and the oxide layer on the second underlay under ambient temperature; etching the second underlay to form the back cavity; etching the first underlay to release the diaphragm and obtaining the microphone chip.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a method for manufacturing a microphone, and more particularly to a method for manufacturing a chip of a MEMS microphone.DESCRIPTION OF RELATED ART[0002]So far, in all the methods of manufacturing the microphone based on the semi-conductor material, polycrystalline silicon is deposited on the substrate to form the diaphragm and back plate, due to the deposit of multi-layer structure, the processes including the high temperature bonding etc. make it hard to control the stress of the diaphragm and back plate, it is very hard to improve its sensitivity and consistency.[0003]Therefore, it is necessary to provide an improved method for a microphone chip to overcome above disadvantage.BRIEF DESCRIPTION OF THE DRAWINGS[0004]Many aspects of the embodiment can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clear...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H04R31/00H04R19/04H04R7/16H04R19/00
CPCH04R31/003H04R19/005H04R2207/021H04R7/16H04R2201/003H04R19/04H04R31/00B81B3/001B81B2201/0257B81C1/00182
Inventor SERENE, GOH WAN LINGENG, LOO LIVERONICA, TAN QIU YUZHONG, XIAOHUISHUNG, LIN YIHKEEN, LAI KAH
Owner AAC TECH PTE LTD