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Semiconductor structure and the method of making the same

Active Publication Date: 2019-04-18
UNITED MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention simplifies the manufacturing process by using the same material layer to form the high-k dielectric layer of the transistor and the resistive switching layer in the RRAM. This reduces the number of process steps and integrates the RRAM process with the transistor process.

Problems solved by technology

Upon application of a sufficient voltage, a metallic bridge is induced to form across the data storage layer, which results in the low resistance state.

Method used

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  • Semiconductor structure and the method of making the same
  • Semiconductor structure and the method of making the same
  • Semiconductor structure and the method of making the same

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Embodiment Construction

[0011]To provide a better understanding of the present invention to users skilled in the technology of the present invention, preferred embodiments are detailed as follows. The preferred embodiments of the present invention are illustrated in the accompanying drawings with numbered elements to clarify the contents and the effects to be achieved.

[0012]Please note that the figures are only for illustration and the figures may not be to scale. The scale may be further modified according to different design considerations. When referring to the words “up” or “down” that describe the relationship between components in the text, it is well known in the art and should be clearly understood that these words refer to relative positions that can be inverted to obtain a similar structure, and these structures should therefore not be precluded from the scope of the claims in the present invention.

[0013]Please refer to FIGS. 1, 2, 3, 4 and 5, these figures show the schematic diagrams for fabrica...

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Abstract

The present invention provides a semiconductor structure, the semiconductor structure includes a substrate comprising a diffusion region, a transistor structure on the substrate, and a resistive random access memory (RRAM) on the substrate, wherein the resistive random access memory includes at least one metal silicide layer in direct contact with the diffusion region, and a lower electrode, a resistive switching layer and an upper electrode are sequentially disposed on the metal silicide layer.

Description

BACKGROUND OF THE INVENTION1. Field of the Invention[0001]Embodiments of the invention generally relate to a semiconductor structure, and more particularly, to a transistor and a resistive random access memory (hereinafter abbreviated as RRAM) structure and the manufacturing method thereof.2. Description of the Prior Art[0002]Resistive random access memory (RRAM) has a simple structure, low operating voltage, high-speed, good endurance, and CMOS process compatibility. RRAM is the most promising alternative to provide a downsized replacement for traditional flash memory. RRAM is finding wide application in devices such as optical disks and non-volatile memory arrays.[0003]An RRAM cell stores data within a layer of material that can be induced to undergo a phase change. The phase change can be induced within all or part of the layer to switch between a high resistance state and a low resistance state. The resistance state can be queried and interpreted as representing either a “0” or ...

Claims

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Application Information

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IPC IPC(8): H01L27/24H01L45/00H01L21/02H01L21/265H01L29/08
CPCH01L27/2436H01L45/145H01L45/1675H01L21/02532H01L21/265H01L27/2463H01L29/0843H01L45/1253H01L45/1206H01L45/1608H01L29/517H10B63/30H10N70/8836H10N70/8833H10B99/00H10N70/245H10N70/841H10N70/826H10N70/883H10N70/021H10N70/011H10N70/063H10B63/80H10N70/253
Inventor LIU, CHIH-CHIENHSIEH, CHAO-CHINGYANG, YU-RUCHOU, HSIAO-PANG
Owner UNITED MICROELECTRONICS CORP
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