Substrate polishing device and substrate polishing method

Pending Publication Date: 2020-08-27
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0010]In the polishing process of the substrate performed by pressing the polishing member such as the polishing pad against the substrate, the micro-particles in the polishing solution, those generated from the chipped substrate, and the like adhere to the polishing member, thus clogging the polishing member. The clogging of the polishing member may change the polishing rate and the distribution within the substrate Wf. The above-described conditioning will be performed to retain the polishing member in the optimized state by eliminating the clogging of the polishing member. The conditioning may be performed in the interval between the end of polishing the single substrate, and start of polishing the next

Problems solved by technology

Although the optimum conditions have been determined, the polishing and cleaning performances will inevitably change owing to variation in control of the components, and aging of the consumable material.
Those variations may bring about the variation in the residual film and incomplete removal of the step height in or after the CMP, resulting in the residue of the film that ought to be completely removed remaining.
It is difficult to adjust the variations

Method used

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  • Substrate polishing device and substrate polishing method
  • Substrate polishing device and substrate polishing method
  • Substrate polishing device and substrate polishing method

Examples

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Example

[0042]Embodiments of a partial polishing device according to the present invention will be described referring to the attached drawings. In the attached drawings, the same or similar components will be designated with the same or similar reference signs, and repetitive explanations of the embodiments, thus will be omitted from description of the respective embodiments. Features to be described in the respective embodiments may be applied to other embodiments so long as those features do not mutually conflict.

[0043]FIG. 1 is a schematic view showing a structure of a partial polishing device 1000 according to an embodiment. As FIG. 1 shows, the partial polishing device 1000 is formed on a base surface 1002. The partial polishing device 1000 may be formed as an independent device, or as a module constituting a substrate processing system 1100 including a large-diameter polishing device 1200 using a large-diameter polishing pad together with the partial polishing device 1000 (see FIG. 1...

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Abstract

Provided is a polishing device for appropriately retaining a polishing member in an appropriate state in polishing. The polishing device for partially polishing a substrate includes a polishing member having a processing surface which comes into contact with the substrate and which is smaller than the substrate, a conditioning member for performing conditioning on the polishing member, a first pressing mechanism for pressing the conditioning member against the polishing member in polishing the substrate, and a control unit for controlling an operation of the polishing device. The control unit is configured to control the first pressing mechanism when the substrate is partially polished by the polishing member.

Description

TECHNICAL FIELD[0001]The present invention relates to a device and a method for polishing a substrate.BACKGROUND ART[0002]Recently there has been a processor used for performing various process steps to a processed object (for example, a substrate such as a semiconductor substrate, or various kinds of films formed on the substrate surface). An example of the processor may be a CMP (Chemical Mechanical Polishing) device which performs polishing and the like of the processed object.[0003]The CMP device includes a polishing unit for performing a polishing process to the processed object, a cleaning unit for performing cleaning / drying process to the processed object, and a load / unload unit for delivering the processed object to the polishing unit, and receiving the processed object which has been cleaned and dried by the cleaning unit. The CMP device further includes a carrier mechanism for carrying the processed object among the polishing unit, the cleaning unit, and the load / unload un...

Claims

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Application Information

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IPC IPC(8): B24B53/017B24B37/005B24B53/12
CPCB24B37/005B24B53/017B24B55/06B24B53/12H01L21/304
Inventor YASUDA, HOZUMIKOBATA, ITSUKITAKAHASHI, NOBUYUKISAKUGAWA, SUGURU
Owner EBARA CORP
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