Electronic device including vapor chamber

Abstract

An electronic device may include: a housing, a support member disposed in an internal space of the housing and including a first surface and a second surface facing a direction opposite the first surface, wherein the support member includes a through hole in at least a portion thereof, and a vapor chamber disposed through at least a portion of the through-hole, wherein the vapor chamber may include: a first plate including a first plate portion including a plurality of pillars and a first flange portion extending along an edge of the first plate portion to have a first width, a second plate having a size corresponding to the first plate portion and including a second plate portion including a recess and a second flange portion extending along an edge of the second plate portion to have a second width less than the first width, and at least one wick disposed in the recess, wherein the wick may be accommodated through a closed space defined through coupling of the first plate and the second plate.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a continuation of International Application No. PCT / KR2022 / 001507 designating the United States, filed on Jan. 27, 2022, in the Korean Intellectual Property Receiving Office and claiming priority to Korean Patent Application No. 10-2021-0023220, filed on Feb. 22, 2021, in the Korean Intellectual Property Office, the disclosures of which are incorporated by reference herein in their entireties.BACKGROUNDField[0002]The disclosure relates to an electronic device including a vapor chamber.Description of Related Art[0003]While electronic devices are gradually becoming smaller, functions thereof are gradually being diversified. According to the miniaturization and slimming of electronic devices, electrical elements embedded in an electronic device may be arranged such that the distances of the electronic elements from a surrounding structure are reduced or the electronic elements are concentrated, and may generate high-tempe...

AI Technical Summary

Benefits of technology

This patent describes an electronic device with a vapor chamber that can make the device thinner and more flexible. The vapor chamber is attached to a support member using a strong bond, which helps maintain the device's strength and prevents it from getting bent or change in shape. The plates in the vapor chamber are made stronger through a process like stamping, which helps reinforce the device's mechanical integrity. Overall, this invention makes the device slimmer and stronger, while also reducing manufacturing costs.

Problems solved by technology

Such high-temperature heat may cause malfunction of the electronic device and may cause discomfort to a user.

However, since the vapor chamber is configured to have a relatively large volume through a bonding structure of the two plates, the vapor chamber may act counter to the slimming of the electronic device.

In addition, since pillars are formed on the metal plate through a chemical process (e.g., an etching process), corrosion, perforation, or cracking may occur in the metal plate having a predetermined thickness or less.

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