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Stacked type chip package structure

a chip package and stacking technology, applied in the direction of solid-state devices, basic electric elements, electrical apparatus construction details, etc., can solve the problems of increasing the total thickness of the stacking type chip package structure, not meeting the demands of small volume and light weight of electronic devices, and achieve the effect of not increasing the total thickness of the chip package structur

Active Publication Date: 2010-04-20
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a stacked type chip package structure that includes a backplate, a circuit substrate, a first chip, a second chip, and a conductive film or interposer. The structure is designed to protect the first chip from signal interference and eliminate electromagnetic interference generated from the second chip. The chip package structure does not increase its overall thickness and includes a gap between the interposer and the circuit substrate. The technical effect of the invention is to provide a reliable and efficient solution for stacked chip package structures that offer protection against signal interference and electromagnetic interference while maintaining a slim design.

Problems solved by technology

However, the metallic plate 140 between the first chip 120 and the second chip 130 may cause an increase in total thickness of the stacked type chip package structure 100, and this may not satisfy the demands for small volume and light weight of electronic devices.

Method used

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first embodiment

[0034]FIG. 2 is a schematic cross-section view showing a stacked type chip package structure according to the present invention. The stacked type chip package structure 200 mainly comprises a backplate 210, a circuit substrate 220, a first chip 230, a second chip 240, and a conductive film 250. The backplate 210 comprises a circuit layer 212 on the upper surface of the backplate 210. The circuit substrate 220 is disposed on the backplate 210, and has an upper surface 220a and an opposite lower surface 220b. The circuit substrate 220 has a receiving hole 222 corresponding to the backplate 210 for receiving the first chip 230. The circuit substrate 220 may be replaced by a printed circuit board (PCB), a chip carrier and so on. Besides, a plurality of solder balls 224 may be optionally formed on the lower surface 220b of the circuit substrate 220, such that the stacked type chip package structure 200 may be electrically connected to other electronic devices through these solder balls 2...

second embodiment

[0037]FIG. 3 is a schematic cross-section view showing a stacked type chip package structure according to the present invention. Referring to FIG. 3, most of the components of the stacked type chip package structure 200′ are similar to those of the stacked type chip package structure 200 as shown in FIG. 2, and the difference between them is that an interposer 270 is used to replace the conductive film 250 as shown in FIG. 2. In this embodiment, the interposer 270 is disposed between the first chip 230 and the second chip 240. More specifically, a gap exists between the interposer 270 and the circuit substrate 220, and the interposer 270 is electrically connected to a ground (not shown) of the circuit substrate 220 by wire bonding technique. However, the interposer 270 may be electrically connected to a ground (not shown) of the circuit substrate 220 by bumps 280 as shown in FIG. 4. The method for electrically connecting the interposer 270 and the circuit substrate 220 is not limite...

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Abstract

A stacked type chip package structure including a backplate, a circuit substrate, a first chip, a second chip, and a conductive film is provided. The backplate comprises a circuit layer. The circuit substrate is disposed on the backplate, and has an upper surface and an opposite lower surface. Besides, the circuit substrate has a receiving hole corresponding to the backplate. The first chip is disposed inside the receiving hole, and the first chip is electrically connected to the circuit substrate through the circuit layer of the backplate. The second chip is disposed above the first chip, and is electrically connected to the circuit substrate. The conductive film is disposed between the first chip and the second chip, wherein the conductive film is electrically connected to a ground of the circuit substrate.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention generally relates to a stacked type chip package structure, and more particularly, to a stacked type chip package structure having a RF (radio frequency) chip.[0003]2. Description of Related Art[0004]In accordance with the highly advanced telecommunication in our modern society, the chip structure has to be developed in response to the influence of electronic equipment being digitized, network applicable, locally connectable, and humanized for the electronic equipment. To achieve the above objectives, high processing speed, multi-functional, integration, small volume, light weight, and low cost are all required. Nowadays, many electronic devices must use RF chips with other kinds of chips, such as RF chip in conjunction with digital IC, digital signal processor (DSP), or base band (BB) chip, for achieving the purposes of small volume and high processing speed. However, since RF chips belong to high...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H01L23/02
CPCH01L23/3128H01L25/0657H01L25/18H01L23/552H01L2224/73265H01L2224/73253H01L2224/32225H01L2224/32145H01L2924/19107H01L2924/15151H01L2224/16225H01L24/48H01L2924/3025H01L2924/19105H01L2924/1532H01L2924/15311H01L2224/48227H01L2225/0651H01L2225/06517H01L2225/0652H01L2225/06527H01L2225/06572H01L2924/15153H01L2924/00012H01L2924/00H01L24/73H01L2924/00011H01L2924/00014H01L2924/181H01L2224/0401H01L2224/45099H01L2224/45015H01L2924/207
Inventor KIM, HYEONG-NO
Owner ADVANCED SEMICON ENG INC