Imaging systems with through-oxide via connections

Abstract

An imaging system may include an image sensor package with through-oxide via connections between the image sensor die and the digital signal processing die in the image sensor package. The image sensor die and the digital signal processing die may be attached to each other. The through-oxide via may connect a bond pad on the image sensor die with metal routing paths in the image sensor and digital signal processing dies. The through-oxide via may simultaneously couple the image sensor die to the digital signal processing die. The through-oxide via may be formed through a shallow trench isolation structure in the image sensor die. The through-oxide via may be formed through selective etching of the image sensor and digital signal processing dies.

Description

BACKGROUND[0001]This relates generally to imaging systems, and more particularly, to imaging systems with through-oxide vias in first and second integrated circuit dies.[0002]Modern electronic devices such as cellular telephones, cameras, and computers often use digital image sensors. Imaging systems (i.e., image sensors) often include a two-dimensional array of image sensing pixels. Each pixel typically includes a photosensor such as a photodiode that receives incident photons (light) and converts the photons into electrical signals. The imaging system contains an image sensor die with, an image sensor integrated circuit and an array of photodiodes. The image sensor die is attached to a digital signal processing die with a digital signal processing integrated circuit.[0003]A bond pad on the image sensor die may be coupled to the image sensor integrated circuit and the digital signal processing integrated circuit using vias. However, the amount of time, space, efficiency, and cost f...

AI Technical Summary

Benefits of technology

The patent text describes an improved way of connecting image sensors in imaging systems. The new method uses through-oxide vias to connect the image sensor die to the integrated circuit dies. This can save time, space, and cost. The text also describes an image sensor package with through-oxide vias and a method for making it. The technical effect of this innovation is to improve the efficiency and cost-effectiveness of imaging systems.

Problems solved by technology

However, the amount of time, space, efficiency, and cost for forming via connections between the metal routing paths in the integrated circuits may be limited.

In conventional imaging systems, forming a through-silicon via to connect the image sensor die to the bond pad and forming connections from the bond pad to the digital signal processing die can limit the amount of time space, efficiency, and cost for forming these connections.

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