The invention discloses a PCB
general health management method based on zero-ohmic
resistor time-varying information, and the method comprises the steps: densely packaging a plurality of zero-ohmic resistors on a PCB, carrying out the reverse deduction of the stress damage condition of a PCB product through monitoring the change of the resistance value of the zero-ohmic resistors, recognizing the damage degree of the product in the whole process from the
crack initiation period to a permanent fault, and carrying out the recognition of the damage degree of the product. The zero-
ohm resistor is used as a circuit function element to be embedded in PCB wiring, non-intrusive monitoring is achieved, the installation cost of additional devices is avoided, continuous work can be started from the production stage, the whole
service life cycle of the product is throughout, the limitation that a traditional
strain gauge can only be used in a
specific test stage is broken through, and the
test efficiency is improved. The whole-course stress
damage analysis from manufacturing, transportation to
actual use is provided for the product, high-density point distribution can be achieved through the micro-packaged zero-
ohm resistor, a data sampling set for whole-plate stress
damage analysis is formed through multi-
point data association analysis, and therefore the
stress concentration area is accurately positioned, and compared with a traditional single-point measurement method, the method has the advantages that the measurement accuracy is high, and the
measurement cost is low. And the monitoring precision and reliability are obviously improved.