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The application discloses a quantum sensor chip packaging structure capable of realizing wafer-level planar co-packaging, which comprises a microfabricated atomic cell, a light source chip assembly and a light detection chip assembly, the microfabricated atomic cell is integrated with a reflecting element, the reflecting element is used for adjusting the optical path of the light beam entering the microfabricated atomic cell, the microfabricated atomic cell, the light source chip assembly and the light detection chip assembly are supported on a packaging substrate through a micro-bump assembly and are directly electrically interconnected with the packaging substrate through the micro-bump assembly, the micro-bump assembly comprises a plurality of micro-bumps, the distribution mode of the micro-bumps is for the purpose of realizing the supporting function and the electrical interconnection, the size of the micro-bump supporting the microfabricated atomic cell, the light source chip assembly and / or the light detection chip assembly is adjustable, the optical path of the microfabricated atomic cell is regulated by adopting the combination of micro-bumps with different sizes, and the planar co-packaging of the microfabricated atomic cell and other key quantum sensor components can be realized.