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Resin composition for thermally conductive material and thermally conductive material

A resin composition, thermal conductivity technology, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of residual solvent volatilization, worry about increase, etc.

Inactive Publication Date: 2008-05-07
NIPPON SHOKUBAI CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using the (meth)acrylic resin obtained in this way, there is a concern that the residual solvent will volatilize even in a small amount at a time, and this concern increases especially in applications where heating is used (thermally conductive materials, etc.)

Method used

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  • Resin composition for thermally conductive material and thermally conductive material
  • Resin composition for thermally conductive material and thermally conductive material
  • Resin composition for thermally conductive material and thermally conductive material

Examples

Experimental program
Comparison scheme
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Embodiment

[0081] Below, the present invention is further described in detail through the examples, but the following examples do not limit the present invention, and all changes and implementations within the scope of not departing from the purpose of the foregoing and hereinafter are included in the technical scope of the present invention. However, in Examples and Comparative Examples, unless otherwise specified, "part" means "mass part", and "%" means "mass %".

[0082] Experiment 1 (Experiment on a resin composition in which the polymer (I) is a (meth)acrylic polymer (I-a))

Synthetic example 1

[0084] In a container equipped with a thermometer, a stirrer, a gas inlet tube, a reflux condenser, and a dropping funnel, add 40 parts of 2-ethylhexyl acrylate (2EHA), 50 parts of toluene, and α-methyl 0.3 parts of styrene, the gas in the container is replaced with nitrogen. The temperature was raised to 80° C., and a mixed solution of 0.05 parts of azobisisobutyronitrile and 10 parts of toluene was added as a polymerization initiator to the dropping funnel, and was dropped into the container over 2 hours. Furthermore, 0.01 part of azobisisobutyronitrile was added, it heated up to 90 degreeC, and it superposed|polymerized for 3 hours. Before the completion of the polymerization, air was blown in to cool the system to complete the polymerization to obtain a mixture of poly(2-ethylhexyl acrylate) (PEHA) and toluene. Next, the inside of the system was depressurized and toluene was distilled off to obtain PEHA. The molecular weight of this PEHA measured using GPC (gel permeatio...

Synthetic example 2

[0086] 100 parts of lauryl methacrylate (LMA) was added to a container equipped with a thermometer, a stirrer, a gas introduction tube, and a reflux condenser, and the gas in the container was replaced with nitrogen. The temperature was raised to 80° C., 0.2 parts of mercaptopropionic acid as a chain transfer agent and 0.01 part of azobisisobutyronitrile as a polymerization initiator were added, and bulk polymerization was performed for 3.0 hours under a nitrogen atmosphere. Before the completion of the polymerization, 0.1 part of a polymerization inhibitor hydroquinone was added while blowing in air, and then the system was cooled to terminate the polymerization halfway. The polylauryl methacrylate (PLMA) in the obtained mixture was 50.0%, and the LMA which is a polymerizable monomer (IV) component was 50.0%. The obtained PLMA had a viscosity of 4980 mPa·s at 25°C. The molecular weight of PLMA measured by GPC was weight average molecular weight Mw = 136,000, number average m...

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Abstract

A resin composition for thermally conductive materials which comprises a polymer (I), a liquid plasticizer (II), and a thermally conductive filler (III) having a thermal conductivity of 20 W / m.K or higher, characterized in that the liquid plasticizer (II) is liquid at 25 DEG C and has a percentage loss of weight through 24-hour holding at 130 DEG C of 2 wt.% or smaller. A thermally conductive material excellent in thermal conductivity and flexibility could be obtained from the resin composition for thermally conductive materials.

Description

technical field [0001] The present invention relates to a resin composition for obtaining a thermally conductive material such as a thermally conductive sheet used in heat dissipation applications, and more specifically, to a thermally conductive material excellent in thermal conductivity, flexibility, and formability resin composition. Background technique [0002] A resin composition formed by adding a thermally conductive filler such as alumina, silica, etc. to a flexible resin to solidify and form a sheet-like (thermally conductive sheet) object, such as for the following Use, that is, to interpose the obtained sheet member between heating elements such as electric and electronic components built in various electrical products such as personal computers and plasma displays, and radiators such as heat sinks, heat sinks, and metal heat sinks. It is used for the purpose of dissipating heat generated by electrical and electronic components. Generally, the surface of the he...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L33/06C08K3/00H01L23/36
Inventor 川田雄一田中顺子
Owner NIPPON SHOKUBAI CO LTD