Preparation method of diamond grinding polishing sheet

Abstract

A grinding-polishing diamond disk is prepared through dropping the solution of sodium alginate containing superfine diamond powder into the solution containing Ca ions to prepare the diamond gel beads, adding adhesive, and shaping the product.

Description

technical field [0001] The invention provides a method for preparing ultra-fine-grained diamond grinding and polishing sheets for nano-processing of silicon chips. Background technique [0002] The processing of silicon wafers includes multiple processes such as slicing, chamfering, grinding, etching, cleaning, and polishing, but the technical difficulties mainly focus on grinding. Due to the use of free abrasives, the grinding efficiency is low and the surface is severely scratched. It is difficult to control the corrosion rate stably during the process of etching and removing the scratched layer, which not only affects the surface accuracy of the silicon wafer after grinding, but also increases the final polishing time. Cleaning waste liquid also seriously pollutes the environment. Therefore, the United States, Japan, Germany and other countries began to fix the diamond abrasive in the bond to grind and polish large-scale silicon wafers of 300mm. However, the non-uniform...

AI Technical Summary

Problems solved by technology

However, the use of ultra-fine diamond abrasives with a size as small as 1-5 μm, the non-uniform distribution of abrasive grains in the bond caused by the agglomeration of ultra-fine abrasives has become the main obstacle affecting processing efficiency

Since the powder metallurgy process used in the manufacture of coarse-grained abrasive tools is used in the manufacture of grinding and polishing tools, the problem of uniform abrasive grain distribution has not been fundamentally resolved.