Composite high-strength lead-free brazing filler metal for electronic packaging and preparation method thereof

A technology of composite brazing filler metal and electronic packaging, which is used in manufacturing tools, welding equipment, metal processing equipment, etc. to achieve the effects of dense organization, improved strength and uniform dispersion.

Active Publication Date: 2015-08-19
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problem that the solder joints of lead-free solder in existing electronic products need to with

Method used

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  • Composite high-strength lead-free brazing filler metal for electronic packaging and preparation method thereof
  • Composite high-strength lead-free brazing filler metal for electronic packaging and preparation method thereof
  • Composite high-strength lead-free brazing filler metal for electronic packaging and preparation method thereof

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specific Embodiment approach 1

[0025] Embodiment 1: In this embodiment, a high-strength lead-free composite solder for electronic packaging is composed of graphene and lead-free solder; the mass fraction of graphene in the high-strength lead-free composite solder for electronic packaging is 0.02 % to 0.1%.

[0026] In this embodiment, graphene is added to the traditional lead-free solder, and the strength of the traditional lead-free solder is improved by utilizing the excellent mechanical properties of graphene.

[0027] This embodiment uses ultrasound and alcohol to disperse graphene between lead-free solder powders, and at the same time uses ball milling to mix graphene and lead-free solder, which solves the problem of graphene agglomeration. The dispersion in the powder is more uniform.

[0028] This embodiment adopts alternate, high-speed ball milling process, and alcohol is added in the ball milling tank at the same time. The high-speed rotation facilitates the necessary deformation of the lead-free...

specific Embodiment approach 2

[0031] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the lead-free solder is Sn-Ag-Cu solder, Sn-Cu solder, Sn-Ag solder, Sn-Zn solder, Sn-In solder or Sn-Bi solder. Others are the same as the first embodiment.

specific Embodiment approach 3

[0032] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the mass fraction of graphene in the high-strength lead-free composite solder for electronic packaging is 0.04%. Others are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses composite high-strength lead-free brazing filler metal for electronic packaging and a preparation method thereof. The composite high-strength lead-free brazing filler metal comprises graphene and lead-free brazing filler metal. The preparation method includes the steps of firstly, dispersing the graphene and lead-free brazing filler metal powder in ethyl alcohol under the ultrasonic action, and subjecting the ethyl alcohol solution with the graphene and the lead-free brazing filler metal powder to ball milling mixing; secondly, performing vacuum drying to obtain mixed powder of the graphene and the lead-free brazing filler metal powder; thirdly, placing the mixed powder of the graphene and the lead-free brazing filler metal powder into a mould to be squeezed to form a precast block, placing the precast block along with the mould in a vacuum furnace to sinter for 3 hours at the temperature of 180 DEG C, and demoulding to obtain the composite high-strength lead-free brazing filler metal. The composite high-strength lead-free brazing filler metal for electronic packaging and the preparation method thereof have the advantage that the problem that a lead-free brazing filler metal welding spot of an existing electronic product needs to bear high strength under working is solved.

Description

technical field [0001] The invention relates to a high-strength lead-free composite solder for electronic packaging and a preparation method thereof. Background technique [0002] Tin-lead solder is widely used in the electronics industry, but lead and lead compounds have been listed by environmental protection agencies as one of the most harmful chemical substances to humans and the environment. Therefore, various countries have successively issued laws to prohibit the use of lead-containing solder in the packaging field. In order to replace tin-lead solder, many lead-free solders have been developed, among which Sn-Ag-Cu alloy is the most widely used. [0003] Lead-free solder joints are a critical part of electronic devices, providing mechanical support, electrical and thermal transfer channels for interconnected devices. At the same time, with the rapid development of micro-electro-mechanical systems, it is necessary to manufacture smaller and denser lead-free solder j...

Claims

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Application Information

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IPC IPC(8): B23K35/36B23K35/38B23K35/40
CPCB23K35/36B23K35/38B23K35/40B23K2101/36
Inventor 修子扬武高辉黄奕龙陈国钦郝成丽于海洋张强何鹏
Owner HARBIN INST OF TECH
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