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Method for modulating carrying-performance nano-grade field effect transistor using dipale effect

A field-effect transistor, nano-scale technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as high requirements, difficult practical application, inability to completely overcome the shielding effect of metal electrodes, etc. performance, avoidance of shielding effects, easy-to-achieve effects

Active Publication Date: 2008-11-19
GIGADEVICE SEMICON (BEIJING) INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In previous work, some people have used needle-like source and drain to increase the electric field strength in the contact area, making it conducive to electron tunneling and improving the transport characteristics of the system, but the source and drain are generally It is difficult to make it very small, so the shielding effect of the electrode still exists; some people divide the gate into several sections and apply a stronger gate voltage on the gate closest to the electrode, so that the shielding effect of the metal electrode cannot be completely overcome on the one hand. , but it is limited to a slightly smaller area, because no matter how large the gate voltage is, the shielding effect of the electrode still exists. Gates must be spaced very small and must be non-conductive, making them difficult to apply

Method used

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  • Method for modulating carrying-performance nano-grade field effect transistor using dipale effect
  • Method for modulating carrying-performance nano-grade field effect transistor using dipale effect
  • Method for modulating carrying-performance nano-grade field effect transistor using dipale effect

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Embodiment 1

[0030] Embodiment 1: comprise the following steps:

[0031] 1) Forming a dipole layer on the side surfaces of the source and drain of the nanoscale field effect transistor to change the electrostatic potential of the B region of the device body;

[0032] The specific embodiment of the formation of the dipole layer in the above steps can be formed by adsorbing atoms on the side surface of the electrode, or by adsorbing molecules on the side surface of the electrode, or by introducing a dipole plate on the side surface of the electrode to form a dipole Floor.

[0033] In this embodiment, atoms or molecules that easily lose electrons such as potassium atoms are adsorbed on the side surface of the electrode, and the negative charge 201 generated on the side surface of the electrode is close to the surface, and the positive charge is far away from the dipole layer of the surface, such as figure 2 (a) shown. If atoms or molecules that are easy to obtain electrons are adsorbed on ...

Embodiment 2

[0041] Embodiment 2: comprise the following steps:

[0042] 1) form a dipole layer 301 on the upper surface of the source and drain of the nanoscale field effect transistor, such as image 3 (a) shown. The specific method can adopt any one of the methods for forming the dipole layer in Embodiment 1.

[0043] The change curve 31 of the electrostatic potential of the device body caused by the dipole layer on the upper surface of the source and the drain is as follows image 3 (a), wherein the position flush with the contact surface of the device body and the electrode is set as zero. The dipole layer on the upper surface of the electrode mainly changes the electrostatic potential of the A region.

[0044] 2) Select the strength of the dipole layer on the upper surface of the electrode to adjust the position of the bottom of the conduction band (top of the valence band) in the region A of the device body relative to the Fermi energy pole of the electrode, so that it is benefic...

Embodiment 3

[0048] Embodiment 3: be that embodiment 1, 2 are used in combination, and form dipole layer simultaneously on the side surface and upper surface of the source electrode of nanoscale field effect transistor and drain electrode, specifically form the method for dipole layer, adjust this electrode surface For the size and strength of the dipole layer, as well as for adjusting the on and off of the gate voltage controller, the specific method steps in Embodiments 1 and 2 can be used.

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Abstract

This invention relates to a method for modulating the transport property of nm level field effect transistors by dipole effect including: forming a dipole layer on the surface of the source and drain of the nm level field effect transistor to alter the electrostatic potential of the reality region B or A , selecting the strength of the dipole layer at the electrode surface to make the tunnel through probability of electrons or cavity in region B the largest or favorable for electrons or cavities to inject into the A region of the device from the electrode, adjusting the gate voltage to control the conduction and close of the field effect transistors.

Description

technical field [0001] The invention belongs to the technical field of nanoscale field effect transistors, in particular to a method for modulating the transport characteristics of nanoscale field effect transistors. Background technique [0002] At present, the miniaturization of devices has become a trend in the industrial field, and it is also a hot topic that has attracted much attention. In particular, nanodevices, such as field-effect transistors based on nanotubes or nanowires, have attracted increasing attention. In general, the gate voltage can modulate the transport characteristics of field effect transistors. However, as the size of devices decreases to the nanoscale, especially in systems containing metal electrodes and semiconductor contacts, the potential distribution near the electrodes becomes very important in the transport process. figure 1 (a) is a schematic diagram of such a nanoscale field-effect transistor. Wherein the source and the drain are metall...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/772H01L21/335
Inventor 吴健杨莉段文晖顾秉林
Owner GIGADEVICE SEMICON (BEIJING) INC
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