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High-temperature-resistant high-pressure-resistant ceramic strain gauge sensor and its package curing method

A technology of strain gauge and high pressure resistance, which is applied in the packaging and curing field of sensors and ceramic strain gauge sensors, can solve the problems of limited service life of molded products, small signal receiving range, poor temperature and pressure resistance, etc., and achieve small deformation, Effects of improving reception width and repeatability, and improving wear resistance

Inactive Publication Date: 2008-12-10
西安康培石油勘探技术工程服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] 1. The packaging structure is relatively complicated;
[0004] 2 The signal receiving range is relatively small and the repeatability is relatively poor;
[0005] 3. The temperature and pressure resistance of the formed product is relatively poor, and the operating temperature and pressure range are: 125°C, 45Mpa;
[0006] 4. The service life of molded products is limited, generally 6 to 12 months

Method used

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  • High-temperature-resistant high-pressure-resistant ceramic strain gauge sensor and its package curing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The encapsulation and curing method of the sensor is carried out in the following steps:

[0035] 1) Clean the ceramic strain gauge, sensor housing and strain gauge holder with solvent oil;

[0036] 2) Put the ceramic strain gauge into the strain gauge fixing seat, and weld the electrode lead wires, and pay attention to face the negative electrode upward;

[0037] 3), weighing 1.5-2.5 grams of high-temperature epoxy resin A and curing agent B according to the ratio of 1:1, and placing them in two containers respectively, the carbonization temperature of the high-temperature epoxy resin is below 300°C;

[0038] 4) Put the weighed high-temperature epoxy resin and the installed sensor components together into the incubator, and preheat for 1.5 hours at a constant temperature of 75°C to 85°C;

[0039] 5) Take out the preheated high-temperature epoxy resin, and quickly pour high-temperature epoxy resin A and curing agent B into a container and stir evenly, try to keep the h...

Embodiment 2

[0045] The encapsulation and curing method of the sensor is carried out in the following steps:

[0046] 1) Clean the ceramic strain gauge, sensor housing and strain gauge holder with solvent oil;

[0047] 2) Put the ceramic strain gauge into the strain gauge fixing seat, and weld the electrode lead wires, and pay attention to face the negative electrode upward;

[0048] 3), weighing 1.8-2.3 grams of high-temperature epoxy resin A and curing agent B according to the ratio of 1:1, and placing them in two containers respectively, the carbonization temperature of the high-temperature epoxy resin is below 300°C;

[0049] 4) Put the weighed high-temperature epoxy resin and the installed sensor components together into the incubator, and preheat for 1.5 hours at a constant temperature of 77°C to 83°C;

[0050] 5) Take out the preheated high-temperature epoxy resin, and quickly pour high-temperature epoxy resin A and curing agent B into a container and stir evenly, try to keep the h...

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Abstract

The invention discloses a high-temperature and high-pressure resistant ceramic strain gauge sensor and a packaging and curing method thereof. A strain gauge is connected inside the sensor housing. One end of the strain gauge is connected to the positive electrode lead of the strain gauge, and the other end is connected to the negative electrode lead of the strain gauge. The front end of the sensor housing is connected inside. The strain gauge holder is connected to the front end of the strain gauge holder. The front end potting film is potted on one side of the strain gauge, and the rear end potting film is potted on the other side of the strain gauge. A copper ring is also connected to the rear end potting film. The other end of the negative electrode lead is connected to the copper ring. Encapsulation and curing method: including solvent oil cleaning; welding electrode leads; constant temperature preheating; potting; constant temperature heating; grinding; testing capacitance value. It has the characteristics of simple structure, easy use, long service life and simple packaging process, which improves the signal receiving amplitude and repeatability; the temperature and pressure resistance reaches 150℃, 60MPa; the service life is unlimited and maintenance-free; it is suitable for deformation signal measurement places and underground ultrasonic flow meters, etc.

Description

technical field [0001] The invention relates to a sensor and a ceramic strain gauge sensor packaging and curing method thereof, and is particularly suitable for a high temperature and high pressure resistant ceramic strain gauge sensor and a packaging and curing method thereof. Background technique [0002] At present, the sensors packaged with ultrasonic probes used in ultrasonic flowmeters used for oil well and water well production and injection in oilfield testing mainly place ceramic strain gauges in a housing, and the two electrodes of the ceramic strain gauges are drawn out through high-pressure sealing plugs. Filled with transformer oil or silicone oil, the oil plays the role of insulation and pressure balance. The main defects of this packaging form are: [0003] 1. The packaging structure is relatively complicated; [0004] 2 The signal receiving range is relatively small and the repeatability is relatively poor; [0005] 3. The temperature and pressure resistanc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01F1/66G01F15/00G01F15/02G01F15/10E21B47/00H01L49/00H01L21/50E21B47/017H10N99/00
Inventor 邓军安赵宏斌张超峰
Owner 西安康培石油勘探技术工程服务有限公司
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