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Electronic device and packaging arrangement thereof

A packaging structure and electronic device technology, applied in nonlinear optics, instruments, optics, etc., can solve the problems of not being able to achieve airtightness, affecting its reliability, affecting the quality of optical imaging, etc.

Inactive Publication Date: 2008-12-24
HIMAX TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] But in such a structure, since the flexible circuit board 30 needs to extend from the front bottom of the housing 10 through one side of the housing 10, when the cover plate 40 is covered on the housing 10, the cover plate 40 must be Due to the existence of the flexible circuit board 30, there is a small gap between the housing 10 and complete airtightness cannot be achieved. Therefore, moisture, dust and temperature changes in the working environment will affect the operating characteristics of the LCOS panel. Influence, especially in the application of optical engineering, will affect the optical imaging quality and affect its reliability

Method used

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  • Electronic device and packaging arrangement thereof
  • Electronic device and packaging arrangement thereof
  • Electronic device and packaging arrangement thereof

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Embodiment Construction

[0036] Figure 2a to Figure 2d A perspective view showing the package structure of the present invention. exist Figure 2a and Figure 2b Among them, the panel 200 of the LCOS is bonded to the bottom of the front of the housing 100 made of ceramics using an adhesive material with high thermal conductivity, and a first metal pad 110 and a metal connector 120 are provided on the bottom of the front of the housing 100, respectively, by means of the design The printed circuit (not shown) on the front bottom of the housing 100 is electrically connected to the metal pad 210 of the panel 200 and the ITO (indium tin oxide) glass plate 220 of the panel 200 .

[0037] exist Figure 2c as well as Figure 2d Among them, the cover plate 400 made of glass is tightly bonded to the housing 100 by an adhesive material, and the adhesive material may be an epoxy-based thermal adhesive material. In this way, the panel 200 can be sealed in the casing 100 to achieve good airtightness. In addit...

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Abstract

An electronic device and its packaging structure. The packaging structure is used to package a panel. It includes: a shell, the shell is used to accommodate the panel, and has: a first metal pad, the first metal pad is provided on the The bottom of the front side of the housing and is electrically connected to the panel; and a second metal pad, the second metal pad is located at the bottom of the back side of the housing and is electrically connected to the first metal pad; and a cover plate , the cover plate is closely connected to the casing and the panel is sealed in the casing.

Description

technical field [0001] The present invention relates to an encapsulation structure, in particular to an encapsulation structure capable of completely sealing a panel in a ceramic casing. Background technique [0002] The packaging structure of the known LCOS (Liquid Crystal On Silicon) panel, such as Figure 1a , 1b As shown, the LCOS panel 20 is usually accommodated in a casing 10 for packaging, and a flexible circuit board 30 is electrically connected to a metal pad (not shown) provided on the front bottom of the casing 10, and the metal The pad is also electrically connected to the panel, whereby the signal of the panel 20 can pass through the metal pad, and then output to the light emitting unit (not shown) of the LCOS outside the package structure through the flexible circuit board 30 . [0003] But in such a structure, since the flexible circuit board 30 needs to extend from the front bottom of the housing 10 through one side of the housing 10, when the cover plate 40...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1333G02F1/1339
Inventor 陈燕晟李国永田家昌
Owner HIMAX TECH LTD