Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

An after-treatment fluid for copper surface black oxidation

A post-treatment liquid, black oxidation technology, applied in the field of chemical treatment, can solve the problems of high price and affect the quality of the board, and achieve the effect of low price and favorable bonding strength

Inactive Publication Date: 2008-12-24
GUANGDONG TONESET SCI & TECH
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] As the reduction purpose, dimethylamine borane (DMAB) and diethylamine borane (DEAB) are usually selected as reducing agent at present, because they are expensive and easy to hydrolyze, the DMAB by-product remains in the solution after reduction, Accumulation, which forms particles on the board after accumulation, thus affecting the quality of the board

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An after-treatment fluid for copper surface black oxidation
  • An after-treatment fluid for copper surface black oxidation
  • An after-treatment fluid for copper surface black oxidation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0070] Ethanolhydrazine 4.75 g / L

[0071] Thiourea 20 mg / L

[0072] NaOH 6 g / L

[0073] Deionized water up to 1 liter

Embodiment 2

[0075] Trimethylamine borane 4.0 g / L

[0076] Thiourea 20 mg / L

[0077] NaOH 6 g / L

[0078] Deionized water up to 1 liter

Embodiment 3

[0080] tert-butylamine borane 5.30 g / l

[0081] Thiourea 20 mg / L

[0082] NaOH 6 g / L

[0083] Deionized water up to 1 liter

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention relates to a kind of processing solution for copper black oxidation. It discloses the water-soluble reducer in the processing solution is tertiary-butyl alkyl borane, trimethyl alkyl borane, ethanol hydrazine or the combination of above compounds. This invention has many water-soluble reducer selections, can reduce the aerugo to copper effectively. The reducer is cheap and will not be hydrolysis. The reduced by-product is water-soluble, will not generate grain on the inner copper. It is good for the adherence of copper and semi-solidified piece.

Description

technical field [0001] The invention relates to the chemical treatment of the black oxidation of the inner copper surface of the printed circuit board. Background technique [0002] In the production process of multilayer printed circuit boards, in order to improve the bonding force between copper and prepreg (polymeric material), one of the commonly used methods is to chemically treat the copper surface, that is, black oxidation treatment, so that the copper surface forms a tiny rough shape. appearance, increase the specific surface area of ​​the copper surface, and at the same time, a layer of polar copper oxide is formed on the copper surface, which improves the bonding force between the copper surface and the prepreg (polymer material). However, copper oxide is prone to hydrolysis and dissolution when exposed to an acidic solution. Since it needs to be in contact with an acidic treatment agent in the subsequent production process, the oxide film on the copper surface wil...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/38
Inventor 李宏钦王植材叶绍明涂敬仁
Owner GUANGDONG TONESET SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com