Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor device and manufacturing method thereof

A semiconductor and device technology, applied in the field of semiconductor devices and their manufacturing, can solve problems such as increased gate resistance, achieve high performance and avoid damage

Active Publication Date: 2009-01-21
MICRON TECH INC
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because there is interference of a high-resistance film between the doped silicon film 304a and the non-doped silicon film 304b, the gate resistance increases

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor device and manufacturing method thereof
  • Semiconductor device and manufacturing method thereof
  • Semiconductor device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0068] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0069] 1 to 20 are schematic diagrams showing a process for manufacturing a semiconductor device having a double-gate structure transistor and a trench-gate transistor according to an embodiment of the present invention. In FIGS. 1 to 20, "M region" indicates a memory cell region in which trench gate transistors are formed, and "P region" and "N region" are provided in peripheral circuits, where "P region" is used to form A region of a planar P-channel transistor with a gate electrode (also referred to as a P-type peripheral circuit region), and the gate electrode contains P-type polysilicon, and wherein the "N region" is used to form a region with a gate electrode in it. A region of planar N-channel transistors (also referred to as an N-type peripheral circuit region), and the gate electrode comprises N-type polysilicon.

[0070] First, as sh...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Gate trenches 108 are formed in a memory cell region M using a silicon nitride film 103 as a mask in a state in which the semiconductor substrate 100 in a P-type peripheral circuit region P and an N-type peripheral circuit region N is covered by a gate insulating film 101 s, a protective film 102 , and the silicon nitride film 103 . A gate insulating film 109 is then formed on the inner walls of the gate trenches 108 , and a silicon film 110 that includes an N-type impurity is embedded in the gate trenches 108 . The silicon nitride film 103 is then removed, and a non-doped silicon film is formed on the entire surface, after which a P-type impurity is introduced into the non-doped silicon film on region P, and an N-type impurity is introduced into the non-doped silicon film on regions M and N.

Description

technical field [0001] The present invention relates to a semiconductor device and a manufacturing method thereof, in particular to a semiconductor device with a trench gate transistor and a double gate transistor and a manufacturing method thereof. Background technique [0002] In recent years, the miniaturization of DRAM (Dynamic Random Access Memory) cells is always accompanied by shortening the gate length of memory cell transistors. However, as the gate length shortens, the short-channel effect in transistors becomes more serious, and there is a problem of increased subthreshold current. When the substrate impurity concentration is increased to minimize the short channel effect, deterioration of refresh characteristics in DRAM due to increase in junction leakage becomes a serious problem. [0003] In order to solve these problems, attention has been paid to a so-called trench gate transistor (also called a recess type transistor), which means that a gate electrode is e...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/8242H01L27/108H10B12/00
Inventor 白竹茂
Owner MICRON TECH INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More