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Phase change film material of silicon-adulterated sulfur series for phase change memory

A technology of phase-change memory and chalcogenide, which is applied in the field of materials in the field of microelectronics technology, can solve problems affecting the contact between phase-change thin films and electrodes or other film layers, affecting device stability, and unfavorable device operation, so as to reduce write The effect of operating current, improving life, and good energy transmission

Inactive Publication Date: 2009-04-08
SHANGHAI JIAOTONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this process, the thickness of the phase change film will change, if the change is too large, it will affect the contact between the phase change film and electrodes or other film layers, thus affecting the stability of the device
Commonly used Ge 2 Sb 2 Te 5 The thickness of the film varies greatly between the amorphous state and the crystalline state, which is not conducive to the long-term stable operation of the device

Method used

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  • Phase change film material of silicon-adulterated sulfur series for phase change memory
  • Phase change film material of silicon-adulterated sulfur series for phase change memory
  • Phase change film material of silicon-adulterated sulfur series for phase change memory

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Experimental program
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Effect test

Embodiment 1

[0026] The phase change material series is Si doped into Te a Ge b Sb 100-(a+b) Alloy Si-doped Ge-Sb-Te films. The ranges of parameters a and b are proposed with reference to the parameter ranges of the patents of S.R.Ovshinsky et al. on phase change memory. figure 2 Si doped Ge obtained for different Si doping amounts 2 Sb 2 Te 5 Thin films and commonly used Ge 2 Sb 2 Te 5 The relationship between film resistivity and annealing temperature. At a temperature of 160°C and below, all films are in an amorphous state, and the film resistance is in a high resistance state. As the annealing temperature increases, the film begins to crystallize, and the film resistivity begins to decrease. When the film is crystallized, the film resistance is in a low resistance state. This process is realized in the device by heating the phase-change film with electric pulses, and the reversible transition between the high-resistance state and the low-resistance state can be achieved by a...

Embodiment 2

[0033] The phase change material series is a Si-Sb-Te alloy film formed by completely replacing the Ge element in the Ge-Sb-Te alloy with Si element. Figure 4 For the Si-Sb-Te chalcogenide film of the present invention and the commonly used Ge 2 Sb 2 Te 5 The relationship between film resistivity and annealing temperature. At a temperature of 160°C and below, all films are in an amorphous state, and the film resistance is in a high resistance state. As the annealing temperature increases, the film begins to crystallize, and the film resistivity begins to decrease. When the film is crystallized, the film resistance is in a low resistance state. This process is realized in the device by heating the phase-change film with electric pulses, and the reversible transition between the high-resistance state and the low-resistance state can be achieved by applying different electric pulses. Si-Sb-Te alloy thin films compared with commonly used Ge 2 Sb 2 Te 5 thin film, its amorp...

Embodiment 3

[0042] Both Ge element and Si element are group IV elements and have the same valence in the alloy, so the element Si can partially or even completely replace the Ge element in the Ge-Sb-Te alloy. When the Si element completely replaces the Ge element, it forms an implementation Si-Sb-Te alloy thin films described in Example 2. Si elements partially replace Te a Ge b Sb 100-(a+b) The Ge element in the alloy can form Te a Ge b-c Si c Sb 100-(a+b) alloy film. With reference to the experimental results of Example 1 and Example 2, it can be seen that the partial replacement of Ge elements by Si elements can still achieve the following effects: (1) improve the amorphous / crystalline resistance change rate of the film, thereby improving the on / off of the device Compare. (2) At the same time, the crystalline resistance of the thin film is appropriately increased, so as to achieve the purpose of reducing the writing operation current. (3) Lower the melting point of the film. ...

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Abstract

The invention is concerned with the phase change film material containing silicon series cluster subject, that is the silicon group subject alloy TeaSibSb100-(a+b) with the a no lesser than 48 but no more than 60, and the b no less than 8 but no more than 40. The invention has the higher crystalline state resistance and non / crystalline resistance change ratio compare to the Ge2Sb2Te5 phase change film, the lower change ratio of the non / crystalline film thickness and melting point. The memorizer including the Si series sulfur group subject phase change film is with the higher ratio sum of the switch stability and it helps the writing operation current.

Description

[0001] The present invention is based on the patent application number: 200510028671.X, the patent application name is: "silicon-containing series chalcogenide phase change thin film material for phase change memory", the patent applicant is: Shanghai Jiaotong University, silicon storage technology company, The patent application date is: a patent divisional application on August 11, 2005. technical field [0002] The invention relates to a material in the technical field of microelectronics, in particular to a silicon-containing series chalcogenide phase-change thin film material used for a phase-change memory. Background technique [0003] The basic principle of phase change memory technology is to use phase change thin film material as storage medium. The resistivity of phase change thin film is very different between amorphous state and crystalline state. Using programmed electric pulse can make phase change thin film in amorphous state The reversible conversion between ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L45/00G11C11/56G11B7/243C22C29/00G03C1/705G11B7/2433
Inventor 冯洁乔保卫赖云峰蔡炳初陈邦明
Owner SHANGHAI JIAOTONG UNIV
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