Feeding hole

Abstract

An object of the present invention is to provide a feed port which does not have to worry about corrosion or dust adhesion during sample transfer. The feeding port of the present invention is arranged on the atmospheric side conveying device (5), and the space for carrying the sample of the processing object, that is, the carrying chamber (12), is provided inside the atmospheric side conveying device (5). Including: a workbench (24) for placing the container (15) containing the above-mentioned sample; a partition (16) arranged on the above-mentioned workbench (24) and having a surface facing the above-mentioned transfer chamber; The exhaust duct (20) on the side of the above-mentioned transfer room of (16); and the fan (21) arranged at the lower end of the above-mentioned exhaust duct (20), utilizing the above-mentioned exhaust duct (20) and the above-mentioned fan (21), The ambient gas in the transfer chamber (12) of the atmosphere-side transfer device is exhausted to the atmosphere.

Description

technical field [0001] The present invention relates to a charging port of a semiconductor manufacturing apparatus, and more particularly, to a charging port of a conveying apparatus provided in the atmosphere of a semiconductor manufacturing apparatus for operating a container for accommodating a sample before or after processing. Background technique [0002] In the semiconductor manufacturing process, samples such as semiconductor element substrates to be processed are accommodated in what is called a "Front Opening Unifeid Pod" (FOUP—Front Opening Unifeid Pod) or a "Front Opening Shipping Box" (FOSB—Front Opening Shipping Box). Box), and transported to a semiconductor manufacturing apparatus by a transporting device in a substantially airtight state. [0003] At this time, samples such as semiconductor element substrates are not in contact with the outside air until they are transported to the processing chamber. [0004] Therefore, a handling device called a loading po...

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Problems solved by technology

[0006] However, the above-mentioned prior art has not considered the gas pressure difference between the inside of the container and the inside of the semiconductor device. When opening the door that communicates with the inside of the two, there is a problem that the gas inside the semiconductor processing device will be affected by the difference in gas pressure. If it flows into the container, the dust generated from the drive part of the door of the charging port or the dust of the atmospheric side transfer robot will adhere to the semiconductor element substrate and cause pollution.

[0007] At this time, even in the case of the prior art in which a fan is provided on the upper or lower part of the transfer chamber, which is a space for transferring samples such as semiconductor element substrates inside the semiconductor manufacturing equipment, the air flow must be sent to the part provided at the charging port. The inner side of the container such as FOUP is difficult, and when it is processed in the semiconductor manufacturing equipment that uses corrosive gas, there are problems such as corrosion around the FOUP of the supply port.

[0008] In addition, the driving chamber, such as the driver of the door that accommodates the opening and closing of the feed port, is separated from the conveying chamber by a partition, and the components connected to the door body or the conveyer for conveying connected to the door body and the driving chamber can move, so If the partition plate is provided with a guiding groove as an opening, the corrosive gas present in the transfer chamber will enter the drive chamber through the opening, and corrosion may occur near the connection part of the transfer device or the driver and foreign matter may appear. Furthermore, there is a possibility that these foreign substances adhere to the substrate of the semiconductor element and the like.

For these problems that may occur, the above-mentioned prior art does not make any consideration

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