A group III-V compound semiconductor and a method for producing the same
A compound and semiconductor technology, applied in the field of III-V compound semiconductors, can solve problems such as brightness drop
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Embodiment 1
[0097] Supplying TMG and ammonia as raw materials and hydrogen as a carrier gas, a low-temperature grown GaN buffer layer was grown on the C-plane of sapphire at 490°C.
[0098] Once the supply of TMG was stopped, the temperature was raised to 1090°C, and then TMG, ammonia, and silane were supplied as raw materials and hydrogen as a carrier gas to grow an n-type GaN layer with a thickness of 3 μm, and then the supply of silane was stopped to grow a thickness of 300nm undoped GaN layer. After stopping the supply of TMG and silane and then cooling to 785°C, supplying TEG and ammonia as raw materials and nitrogen as a carrier gas, a GaN layer with a thickness of 100 nm was grown, and then the following procedure was repeated 5 times in which, at 50 kPa TEG, TMI, and ammonia as raw materials and nitrogen as a carrier gas were supplied under a pressure of 100 nm to grow an InGaN layer with a thickness of 3 nm and a GaN layer with a thickness of 15 nm. The details of the growth pro...
Embodiment 2
[0105] An LED was obtained by the same operation as in Example 1 except that the thickness of the p-type GaN layer was changed to 450 nm. LEDs were evaluated under the same conditions as in Example 1. The results are shown in Table 1.
Embodiment 3
[0107] An LED was obtained by the same operation as in Example 1 except that the thickness of the p-type GaN layer was changed to 300 nm. LEDs were evaluated under the same conditions as in Example 1. The results are shown in Table 1.
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