Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
A technology of microelectronic workpieces and electrochemical processing, which is applied to electrochemical processing equipment, machine tools suitable for grinding workpiece planes, metal processing equipment, etc., and can solve problems such as large voltage drop, large diameter, and increased voltage
Inactive Publication Date: 2009-08-19
MICRON TECH INC
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Problems solved by technology
In addition, direct current may form a passivation layer on the surface of the metal layer that can exacerbate the voltage drop
This phenomenon is particularly problematic for processing larger wafers (e.g., 300mm) due to the large diameter of these wafers and thus the large voltage drop
Method used
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[0024] Several methods and apparatus are disclosed for removing material from microelectronic workpieces used in the fabrication of semiconductor devices, micromechanical devices, and other types of devices. hereinafter, and in Figure 3-7 Some detailed descriptions of certain embodiments of the present invention will be given in the following to facilitate a complete understanding of these embodiments. However, it is understood that other embodiments may be practiced by those skilled in the art, or that the invention may be practiced without departing from some of the detailed descriptions below.
[0025] image 3 An example of an electrochemical-mechanical (ECM) processing apparatus 100 for processing a microelectronic workpiece 110 in accordance with one embodiment of the invention is shown. The electrochemical-machining device 100 may be used to plate a layer of material 111 on a machined surface 113 of a workpiece 110 and / or to remove material from the layer 111 . The ...
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An apparatus and method for electrochemical-mechanical processing of microelectronic workpieces, the electrochemical machining apparatus according to the present invention includes: a workpiece support configured to accommodate a microelectronic workpiece, a workpiece electrode, a first remote electrode and a second A remote electrode, a workpiece electrode, is positioned to contact the work surface of the workpiece when the workpiece is received in the workpiece holder, the first and second remote electrodes being spaced apart from the workpiece holder. The equipment also includes: AC AC power supply, DC DC power supply and conversion components. The conversion assembly is connected with the workpiece electrode, the first remote electrode and the second remote electrode. In operation, the conversion assembly electrically connects the AC source to the conversion assembly for electrical connection with the first and second remote electrodes via the conversion assembly; the DC source is electrically connected to the conversion assembly for electrical connection via A transition assembly is in electrical communication with the workpiece electrode and at least one of the first and second remote electrodes for electroplating, deplating and / or mechanically removing material.
Description
technical field [0001] The present invention relates to a method and apparatus for electroplating and removing material on microelectronic workpieces using electrochemical-mechanical processing. Background technique [0002] A typical microelectronic workpiece includes a substrate having multiple components, such as memory cells interconnected by wires and other components. The wires can be formed by forming a cable trench or some grooves on the workpiece, and then placing a conductive material or some compound in the cable trench. The covering layer of conductive material that is part of the conductive material over the cable trench is then removed, leaving a discontinuous line of conductive material within the cable trench. [0003] Electrochemical machining can be used both to place and remove metal layers. A typical electrochemical plating process involves placing a seed layer on the surface of the workpiece using chemical vapor deposition (CVD) and physical vapor depo...
Claims
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IPC IPC(8): B24B37/04B24B49/10B23H5/08B23H5/10C25F7/00C25D5/04B23H3/00B24B1/00B24B7/19C25D5/06C25D5/18C25D5/22C25D5/48C25D7/12C25D17/10C25D17/14C25F3/16H01L21/288H01L21/304
CPCH01L21/32125C25D17/14C25D5/18C25D7/123C25D5/22C25F7/00B23H5/10C25D17/10C25D5/06B23H5/08B24B49/10B24B37/04C25F3/16C25D7/12B24B37/042C25D17/001H01L21/304H01L21/02
Inventor 斯科特·E·穆尔沃恩集·李斯科特·G·米克尔特伦格·T·多恩
Owner MICRON TECH INC