Projection optical system and projection exposure device

Abstract

The invention provides a projection optical system and a projection exposure device thereof. The projection optical system is divided into a front group and a rear group, and the aperture diaphragm is used as a symmetrical plane. Wherein, the front group includes three groups of mirror groups, and the rear group also includes three groups of mirror groups. The three groups of mirror groups in the front group and the three groups of mirror groups in the rear group are respectively symmetrical about the aperture stop, and each group of mirror groups is composed of Inverse telephoto optical structure composed of negative lens and positive lens. The first mirror group in the front group includes lenses L1-L4, the second mirror group includes lenses L5-L6, and the third mirror group includes lenses L7-L8; the fourth mirror group, fifth mirror group and sixth mirror group in the rear group The lenses L9-L10, L11-L12, and L13-L16 are respectively included. Wherein, the material of lenses L1 and L7 is fused silica glass, the material of lenses L2-L5 is flint glass, and the material of lenses L6 and L8 is crown glass. The working wavelength of the projection optical system is g-line, h-line and i-line wide spectral light, the imaging quality is good, the internal absorption of the lens material is small, and the total optical length is small.

Description

technical field [0001] The invention relates to the field of projection optical systems, in particular to a projection optical system and a projection exposure device used in the field of semiconductor photolithography technology. Background technique [0002] With the development of projection lithography technology, the performance of projection optical system is gradually improved. At present, projection lithography technology has been successfully applied in the field of integrated circuit manufacturing with submicron and deep submicron resolution. In addition, due to the requirements of semiconductor bump packaging technology (Gold-Bumping, Solder-Bumping) and silicon-level chip-scale packaging technology (WLCSP), resulting in lower resolution (such as a few microns), larger depth of focus, and larger The demand for high-yield projection exposure equipment is gradually increasing. [0003] In order to meet the requirements of the above-mentioned projection optical sys...

AI Technical Summary

Problems solved by technology

The patent gives the structural data of the objective lens, and also gives the imaging quality, but its aberration correction degree and the inclusion of two glued surfaces cannot meet the requirements of bumping lithography technology at all.

[0006] At present, there are also patents that propose a projection optical system that meets the requirements of Bumping lithography technology. Both the image field and numerical aperture can obtain the expected value, but there are restrictions on the working wavelength and the working distance of the object space or image space, and the total optical length cannot be very long. Good to meet the expected value, and due to the selection of the lens material, there is a problem of large internal absorption of the material, which will lead to the negative impact of many image quality degradation caused by the absorption of light energy by the lens material in the projection exposure device using the projection optical system

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