Projection optical system and projection exposure device

Abstract

The invention provides a projection optical system and a projection exposure device thereof, wherein, the projection optical system is divided into a front group and a rear group and takes an aperture diaphragm as the symmetry plane; each of the front group and the rear group comprises three groups of lens groups; the three groups of lens groups of the front group and the three groups of lens groups of the rear group are respectively symmetrical relative to the aperture diaphragm; each group of lens group is a retrofocus optical structure consisting of a negative lens and a positive lens; the first lens group of the front group comprises lens L1, lens L2, lens L3 and lens L4, while the second lens group comprises lens L5 and lens L6 and the third lens group comprises lens L7 and lens L8; the fourth lens group of the rear group comprises lens L9 and lens L10, while the fifth lens group comprises lens L11 and lens L12 and the sixth lens group comprises lens L13 to L16; the lens L1 and lens L7 are made from molten quartz glass, while the lens L2 to L5 are made from flint glass, and the lens L6 and the lens L8 are made from crown glass. The operating wavelength of the projection optical system is g-line, h-line and i-line wide spectrum light, thereby having high imaging quality; moreover, lens material has small intrinsic absorption and less optical total length.

Description

technical field [0001] The invention relates to the field of projection optical systems, in particular to a projection optical system and a projection exposure device used in the field of semiconductor photolithography technology. Background technique [0002] With the development of projection lithography technology, the performance of projection optical system is gradually improved. At present, projection lithography technology has been successfully applied in the field of integrated circuit manufacturing with submicron and deep submicron resolution. In addition, due to the requirements of semiconductor bump packaging technology (Gold-Bumping, Solder-Bumping) and silicon-level chip-scale packaging technology (WLCSP), resulting in lower resolution (such as a few microns), larger depth of focus, and larger The demand for high-yield projection exposure equipment is gradually increasing. [0003] In order to meet the requirements of the above-mentioned projection optical sys...

AI Technical Summary

Problems solved by technology

The patent gives the structural data of the objective lens, and also gives the imaging quality, but its aberration correction degree and the inclusion of two glued surfaces cannot meet the requirements of bumping lithography technology at all.

[0006] At present, there are also patents that propose a projection optical system that meets the requirements of Bumping lithography technology. Both the image field and numerical aperture can obtain the expected value, but there are restrictions on the working wavelength and the working distance of the object space or image space, and the total optical length cannot be very long. Good to meet the expected value, and due to the selection of the lens material, there is a problem of large internal absorption of the material, which will lead to the negative impact of many image quality degradation caused by the absorption of light energy by the lens material in the projection exposure device using the projection optical system

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