Semiconductor chip mounting structure and method for manufacturing same

Abstract

A semiconductor chip dual-sided assembly which has a higher degree of reliability of connections between semiconductor chips and a circuit substrate is realized. This is achieved by the assembly including a plurality of upper side pads (2a) provided on a substrate upper surface (1a); a plurality of lower side pads (2b) provided on a substrate lower surface (1b) corresponding to the upper side pads (2a) across the substrate (1), respectively; a first semiconductor chip (4) having first bumps (8a) joined to the upper side pads (2a), respectively; and a second semiconductor chip (5) having second bumps (8b) joined to the lower side pads (2b), respectively.

Description

technical field [0001] The present invention relates to a mounting structure of a semiconductor chip, and more particularly to a mounting structure of a semiconductor chip in which semiconductor chips are mounted on both surfaces of a circuit board, and a manufacturing method thereof. Background technique [0002] With the development of miniaturization technology of semiconductor processes, memory elements are advancing toward larger capacities. Against such a background, a solid memory such as a flash memory is being used as a part of the recording medium instead of the magnetic recording medium and optical recording medium used in the past. Examples of these applications include IC cards, memory cards for digital cameras, and more widely used SD (Secure Digital: Secure Digital) cards having a security function. In order to record music information and image information, etc., such a memory card will need a larger capacity in the future. [0003] In order to make the mem...

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Problems solved by technology

[0010] However, in the above past structure, such as Figure 9 As shown exaggeratedly, in the process of pressing the semiconductor chip 4 on the circuit board 1 and heating it, since the bumps 8 cause the substrate electrode 2 and the circuit board 1 to undergo large bending deformation, the substrate electrode 2 may sometimes be deformed. 2 Disconnection, the serious problem that the electrical connection between the semiconductor chip 4 and the substrate electrode 2 cannot be obtained, which is the cause of the decline in the yield

Additionally, due to Figure 9 The bonding height of the bump 8 indicated by the heights A and B in the middle varies, so problems such as deterioration of the quality of the bonding portion and poor bonding may occur.

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