Circuit board with thermal rubber heat sink and its manufacturing method

Abstract

The invention discloses a circuit board pasted with a heat conduction glue radiator and a manufacturing method thereof. The film-like planar structure is made of thermally conductive and insulating thermally conductive adhesive, which is covered on the circuit board to form a continuous thermally conductive film, which can increase the size of electrical components or heat dissipation pads without changing the circuit board design. Heat dissipation area, simple structure, easy to manufacture, install and use, the heat dissipation area is not affected by the arrangement of electrical components on the circuit board, and the heat dissipation effect is good; the thermal conductive adhesive can be directly sprayed on the circuit board to make a thermal conductive adhesive to dissipate heat It can also be made into a heat conduction heat sink first, and then the heat conduction heat sink can be cut into the required size and pasted on the circuit board. Different methods can be selected according to the needs. The present invention is especially suitable for the heat dissipation of the circuit board, and can also be applied to Heat dissipation in other cases.

Description

technical field [0001] The invention relates to a heat dissipation technology, in particular to a circuit board pasted with a thermally conductive adhesive radiator and a manufacturing method thereof. Background technique [0002] Some integrated circuits with high power density will be used in circuit board design. In order to ensure that the integrated circuit will not be damaged due to excessive temperature rise during operation, it is usually necessary to add a radiator to it to help dissipate heat. The shape and installation method of the radiator It can be varied, but most of its principles are to help heat dissipation by increasing the heat dissipation area. At present, the commonly used radiators mainly include the following types: [0003] One is a backpack radiator, such as figure 1 As shown, the piggyback heat sink 3 is directly attached to the integrated circuit module 2 on the circuit board 1. This type of heat sink has a large volume and a high height, and it...

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Problems solved by technology

Then the airflow produced by the cooling fan takes away the heat on the heat dissipation pad 5. In order to ensure good heat dissipation, a larger air volume is required, which will consume more electric energy, and the friction between the operation of the fan and the airflow will produce greater heat dissipation. Loud noise will cause noise pollution, and the cooling air will also bring serious ion pollution, resulting in a higher failure rate. In order to ensure the heat dissipation effect with less cooling air volume, there are currently two main methods to improve the heat dissipation effect:

[0005] One method is to expand the area of ​​the heat dissipation pad 5, but for a circuit board with a high-density layout, many electronic components with other functions will be soldered around the heat dissipation pad 5, and the degree of expanding the area of ​​the heat dissipation pad is limited. cannot grow infinitely

[0006] Another method is to add a surface mount heat sink 7 on the original heat dissipation pad 5, such as image 3 As shown, this method has a good effect on increasing the heat dissipation capacity, because the surface mount heat sink 7 must have a certain height, but, in some densely assembled equipment, the spacing between circuit boards is often smaller than that of surface mount heat sinks. The height required by the heat sink, the metal material of the surface mount heat sink 7 is easy to cause a short circuit between the circuit boards, which is not allowed, thus limiting the use of the surface mount heat sink 7

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