Unlock instant, AI-driven research and patent intelligence for your innovation.

Photosensitive resin composition

A technology of photosensitive resin and composition, applied in optics, photosensitive materials for optomechanical equipment, optomechanical equipment, etc.

Inactive Publication Date: 2009-12-16
MERCK PATENT GMBH
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the current situation is that the requirements for transparency, solvent resistance, etc. in interlayer dielectric films, planar films, etc., or the requirements for good temporal stability of photosensitive resin compositions have become more intense, and further improvement is required.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photosensitive resin composition
  • Photosensitive resin composition
  • Photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0056] The photosensitive resin composition of the present invention is prepared by dissolving predetermined amounts of the above-mentioned components in a solvent. At this time, each component may be separately dissolved in a solvent in advance, and each dissolved component may be mixed and prepared in a predetermined ratio before use. The photosensitive resin composition solution used is usually prepared after filtration with a 0.2 μm filter or the like.

[0057] The photosensitive resin composition of the present invention forms a highly insulating, highly transparent and highly heat-resistant film as follows. The film is preferably and suitably used as a planarizing film, an interlayer dielectric film, and the like. It means first coating the solution of the photosensitive resin composition of the present invention on a substrate, forming a circuit pattern, semiconductor device, etc. thereon if necessary, pre-drying the substrate to form a coating film of the photosensiti...

Synthetic example 1

[0062] In a 2,000ml four-necked flask equipped with a stirrer, a condenser, a thermometer and a nitrogen pipe, pour 700g of propylene glycol monomethyl ether acetate, 171g of methyl methacrylate, and 90g of 2-hydroxypropyl methacrylate , 39g methacrylic acid, 6.3g dimethyl-2,2'-azobis(2-methylpropionate) [molecular weight: 230.26] and 4.5g of 2,2'-azobisisobutyronitrile[ Molecular weight: 164.21], heated while feeding nitrogen, and polymerized at 85° C. for 8 hours to obtain an acrylic copolymer 1 with a molecular weight of 11,000.

Synthetic example 2

[0064] In a 2,000ml four-necked flask equipped with a stirrer, a condenser, a thermometer and a nitrogen pipe, pour 700g of propylene glycol monomethyl ether acetate, 171g of methyl methacrylate, and 90g of 2-hydroxypropyl methacrylate , 39g of methacrylic acid, and 12.6g of dimethyl-2,2'-azobis(2-methylpropionate), heated while nitrogen gas was input, and polymerized at 85°C for 8 hours to obtain an acrylic acid copolymer with a molecular weight of 11,000 2.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The photosensitive resin composition of the present invention comprises alkali-soluble resin, photosensitizer containing quinonediazide group, curing agent with epoxy group and phenolic compound represented by general formula (I), wherein alkali-soluble resin utilizes cyano-free Azo polymerization initiators or acrylic resins synthesized by using cyano-azo polymerization initiators and cyano-free azo polymerization initiators as polymerization initiators: (see the formula on the right) where R1, R2, R3, R4, R5 , R6 and R7 all independently represent H, C1-4 alkyl or (see the right formula) m and n are all independently integers of 0-2, a, b, c, d, e, f, g and h are all is an integer of 0-5, and satisfies the relationship: a+b≤5, c+d≤5, e+f≤5, g+h≤5, and i is an integer of 0-2. The photosensitive resin composition forms a thin film with flattened film surface, excellent light transmittance and good temporal stability even after high-temperature baking, and is especially suitable for interlayer dielectric films and flat films of flat panel displays or semiconductor devices.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, in particular to a photosensitive resin composition suitable for manufacturing semiconductor devices, flat panel displays (FPD), etc. A photosensitive resin composition for a planar film, and also relates to a method for forming a heat-resistant film using the above photosensitive resin composition. Background technique [0002] In the broad field of manufacturing semiconductor integrated circuits such as LSI or FPD display panels, manufacturing circuit substrates for thermal heads, etc., photolithography has hitherto been used to form micro elements or perform precision processing. In photolithography, a positive or negative photosensitive resin composition is used to form a resist pattern. In recent years, formation techniques of interlayer dielectric films or planar films used in semiconductor integrated circuits, FPDs, and the like have drawn attention as new applications. In pa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/022G03F7/004G03F7/023H01L21/027
CPCG03F7/0226G03F7/0233
Inventor 高桥修一河户俊二野口拓也
Owner MERCK PATENT GMBH