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Adhesive sheet, semiconductor device, and method for producing the semiconductor device

A technology of adhesive sheets and semiconductors, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, adhesives, etc., and can solve the problems of semiconductor chip end damage becoming larger and filamentous chips becoming larger

Active Publication Date: 2010-01-20
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, on the other hand, an adhesive sheet with a thickness and a low melt viscosity has the problem of increased damage at the end of the semiconductor chip and increased filamentary debris (resin flash) due to dicing of the wafer and the adhesive sheet.

Method used

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  • Adhesive sheet, semiconductor device, and method for producing the semiconductor device
  • Adhesive sheet, semiconductor device, and method for producing the semiconductor device
  • Adhesive sheet, semiconductor device, and method for producing the semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0100] Epoxy resin uses bisphenol F type epoxy resin (using epoxy equivalent 160, Dongdu Chemicals Co., Ltd. product name YD-8170C) 30 parts by weight, and cresol novolak type epoxy resin (using epoxy equivalent 210, Dongdu Chemical Co., Ltd. Tokasei Co., Ltd. product name YDCN-703) 10 parts by weight. As a curing agent for the epoxy resin, 27 parts by weight of phenol novolac resin (trade name Praio-Fen LF2882 manufactured by Dainippon Inki Chemical Industry Co., Ltd.) was used. Epoxy group-containing acrylic copolymer, using epoxy group-containing acrylic rubber (weight-average molecular weight of 800,000 by gel permeation chromatography, glycidyl methacrylate is 3% by weight, Tg is -7°C , Nagase ChemTex Co., Ltd. product name HTR-860P-3DR) 28 parts by weight. As the curing accelerator, 0.1 parts by weight of an imidazole-based curing accelerator (Kyuazol 2PZ-CN manufactured by Shikoku Chemical Industry Co., Ltd. was used) was used. Silica filler is used (made by Admafine ...

Embodiment 2

[0104] HS-230 (thickness: 10 μm) was used for the first adhesive layer, and the same adhesive sheet as in the first example was used for the second adhesive layer and laminated at 60°C to form a first and second adhesive layer. Multilayer adhesive sheet. As a result of measuring the amount of flow in the state where the first adhesive layer and the second adhesive layer were bonded, the first adhesive layer was 200 μm, and the second adhesive layer was 758 μm.

[0105] The multilayer adhesive sheet was bonded to the semiconductor wafer A (thickness 80 μm) to be processed at 60° C. in such a way that the first adhesive layer was in contact with the semiconductor wafer A (thickness 80 μm) to be processed, and then cut Ends. Next, the dicing tape 1 was prepared so that the second adhesive layer b was laminated on the dicing tape 1, and then a laminate was formed at 25° C. with a heated calender roll laminator (Riston manufactured by Du Pont). Figure 4 ). In this case, the dic...

Embodiment 3

[0107] In this embodiment, the same adhesive sheet as in Example 1 was produced, except for a film thickness of 50 μm.

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Abstract

An adhesive sheet that can be used for filling for unevenness attributed to wires, etc. attached to semiconductor chips as well as substrate wiring and that is free from resin burrs at the time of dicing and is satisfactory with respect to thermostability and moisture resistance. There is provided an adhesive sheet characterized by containing 100 parts by weight of resin, the resin comprising 15 to 40 wt.% of polymer component of >= 10x10<4> weight average molecular weight and -50 DEG C to 50 DEG C Tg containing crosslinking functional groups and 60 to 85 wt.% of thermosetting component composed mainly of an epoxy resin, and 40 to 180 parts by weight of filler, which adhesive sheet has a thickness of 10 to 250 mum.

Description

technical field [0001] The present invention relates to an adhesive sheet, a semiconductor device, and a method for manufacturing the semiconductor device. Background technique [0002] In recent years, along with the miniaturization of semiconductor packages, CSP (Chip Size Package, chip size package) of the same size as semiconductor chips and stacked CSPs with multiple semiconductor chips stacked are becoming popular (see for example, JP-A-2001-279197, JP-A-2002-222913, JP-A-2002-359346, JP-A-2001-308262, JP-A-2004-72009). As examples in these communiqués, there are figure 1 As shown, a package in which a semiconductor chip A1 is stacked on a substrate 3 having unevenness caused by wiring 4, or a package such as figure 2 As shown, a package of two or more semiconductor chips A1 of the same size is used, and other semiconductor chip packages and the like are stacked on the semiconductor chip having unevenness caused by wires 2 and the like. As in the above-mentioned pa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/00C09J163/00H01L21/301
CPCH01L24/27H01L2224/92247H01L2924/0665H01L2224/2919H01L2224/83855H01L2924/01079H01L2224/48227H01L24/83H01L24/29H01L2924/01005H01L2224/32145H01L2924/15311H01L2924/01029H01L2924/0102H01L2224/29H01L2924/01078H01L2924/01012H01L2224/48091H01L2224/73265H01L2924/01077H01L2224/29298H01L2224/32225H01L2924/00013H01L24/73H01L2924/00H01L2924/00014H01L2924/00012H01L2224/29099H01L2224/29199H01L2224/29299H01L2224/2929
Inventor 稻田祯一增野道夫宇留野道生岩仓哲郎
Owner RESONAC CORPORATION