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Radiating device

A heat dissipation device and heat sink technology, which is applied in the direction of cooling/ventilation/heating transformation, instrument cooling, instruments, etc., can solve the problems of single heat transfer direction of heat pipe radiators, heat dissipation fins that cannot be distributed, and improve heat dissipation efficiency effect

Inactive Publication Date: 2010-01-20
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the single heat transfer direction of the heat pipe radiator, it is still not possible to distribute the heat quickly and evenly to the fins, so the performance still needs to be improved.

Method used

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Experimental program
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Embodiment Construction

[0013] see Figure 1 to Figure 4 , the heat dissipation device of a preferred embodiment of the present invention is used to be installed on heat-generating electronic components such as a central processing unit (not shown in the figure) to dissipate heat. The heat dissipation device includes a first substrate 10 in contact with electronic components, a second substrate 20 located on the first substrate 10, a plurality of heat dissipation fins 30 arranged in parallel on the second substrate 20, and a heat dissipation fin attached to the heat dissipation fin. 30 top plate 40, a first heat pipe 50 for conducting heat to the heat dissipation fin 30, a second heat pipe 60 for conducting heat to the top plate 40, and a fan module 70 installed on one side of the heat dissipation device .

[0014] The first substrate 10 is made of metal materials with good thermal conductivity such as copper and aluminum. The first substrate 10 is approximately square, and its upper surface is sym...

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Abstract

The heat sink includes a first base plate contacted to electronic component, a radiator, and a first heat pipe and a second heat pipe connected to the first base plate and the radiator. The radiator includes some heat elimination fins arranged in parallel with gap between fins. Both first heat pipe and a second heat pipe include a heat absorption section connected to the base plate, and a heat output section connected to the radiator. Along long direction of heat elimination fins, the heat output section of first heat pipe is arranged on top of heat elimination fins. The heat output section of second heat pipe is passed through heat elimination fins. Heat pipes in the heat sink are crossed set up in 3D space. Quantity of heat of first base seat contacted to heat source is distributed to heat elimination fins evenly in 3D space so that forced airflow generated by fan module on side of the heat sink carries away quantity of heat rapidly so as to raise heat elimination efficiency.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat pipe heat dissipation device which can effectively cool electronic components. Background technique [0002] With the continuous development of the electronic information industry, the operating speed of electronic components (especially the central processing unit) continues to increase. However, high frequency and high speed increase the heat generated by electronic components, causing their temperature to rise continuously, which seriously threatens the performance of electronic components during operation. In order to ensure the normal operation of electronic components, a large amount of heat generated by electronic components must be discharged in time . [0003] For this reason, the industry usually uses a heat sink to dissipate heat. These existing heat sinks all include a base and a number of heat dissipation fins arranged on the base. device surface. As the volume ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/427G06F1/20G12B15/06
Inventor 曹君武湛周世文
Owner FU ZHUN PRECISION IND SHENZHEN