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Process and equipment for the production of packaging material for electronic component cases

A technology for packaging materials and electronic components, which is applied in the field of manufacturing of packaging materials for electronic component casings and manufacturing equipment, can solve problems such as increased manufacturing costs, and achieve the effect of preventing air residues

Active Publication Date: 2010-01-27
株式会社レゾナックパッケージング
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, there is a problem that the manufacturing cost increases

Method used

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  • Process and equipment for the production of packaging material for electronic component cases
  • Process and equipment for the production of packaging material for electronic component cases
  • Process and equipment for the production of packaging material for electronic component cases

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] (false bonding process)

[0081] The first layer formed by laminating a maleic anhydride-modified polypropylene film (thermoplastic adhesive resin layer) (5) with a thickness of 15 μm on one side of a polypropylene film (thermoplastic resin unstretched film layer) (4) with a thickness of 35 μm. A sheet (1), and a second sheet (2) formed by laminating an aluminum foil (7) with a thickness of 40 μm on one side of a polyamide film (heat-resistant resin stretched film layer) (6) with a thickness of 25 μm, and The form of contact between maleic anhydride modified polypropylene film (5) and aluminum foil (7), in figure 1 The manufacturing device (10) shown passes between the heating roller (12) and the rubber roller (13) for nip pressing and false bonding, followed by the cooling roller (14) for slow cooling to obtain a pre-laminated sheet (3), and wind it up.

[0082] In the above-mentioned false bonding process, the temperature of the preheating roll (11) is set at 70°C, ...

Embodiment 2

[0087] In the dummy bonding process, the packaging material for electronic component cases was produced in the same manner as in Example 1 except that the temperature of the heating roll was set at 150°C and the temperature of the cooling roll was set at 90°C.

Embodiment 3、4

[0089] Except having set the conditions shown in Table 1, it carried out similarly to Example 1, and manufactured the packaging material for electronic component cases.

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Abstract

A process characterized by comprising the temporary bonding step of passing the first sheet (1) consisting of a laminate composed of a non-oriented thermoplastic resin film layer (4) and a thermoplastic adhesive resin layer (5) lying on one side of the layer (4) and the second sheet (2) consisting of a laminate composed of an oriented heat-resistant resin film layer (6) and an aluminum foil layer (7) lying on one side of the layer (6) between a pair of rolls (12, 13) in such a way that the layers (5, 7) are brought into contact with each other and pressing the sheets (1, 2) between the rolls (12, 13) under heating in such a state that the thermoplastic adhesive resin is not molten to bond the sheet (1) to the sheet (2) temporarily and thus form a prelaminated sheet (3) and the complete bonding step of heating the prelaminated sheet (3) to melt the thermoplastic adhesive resin and thereby unite the first and second sheets (1, 2) through adhesive bonding. This process brings about reduction in plant cost and enables high-speed production.

Description

technical field [0001] This invention relates to the manufacturing method of the packaging material for electronic components, such as a lithium ion secondary battery and a capacitor|condenser. [0002] In addition, in this specification, the term "aluminum" is used in the meaning including lithium and its alloy. Background technique [0003] Lithium ion secondary batteries are widely used, for example, as power sources for notebook computers, video cameras, mobile phones, electric vehicles, and the like. As the lithium ion secondary battery, a battery having a structure in which the periphery of the battery main body is surrounded by a casing can be used. As such packaging materials for casings, there is known a material formed by bonding a thermoplastic resin unstretched film and an aluminum foil with a thermal adhesive resin. As a method for manufacturing such a packaging material, it is known that: A method of co-extruding an olefin film and a modified polyolefin resin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C65/40B29C65/20B32B15/08B29K105/22B29K705/02B29L9/00B65D65/40H01M2/02B32B1/00H01M50/119H01M50/121H01M50/129H01M50/133
CPCB32B37/06B29C65/4815B29C66/91933B29C66/83411H01M2/0257B32B2553/00B29K2101/12B32B2311/24B29C66/0242B29K2023/12B29K2023/06Y02E60/12B29K2105/0085B29L2009/003B32B37/02B29C66/91423B29K2305/02B29K2995/0016B32B27/06B29C66/742B29K2096/005B29K2077/00H01M2/0277B29K2067/00B29C66/83413B29C66/0342B29C65/48B29K2995/005B32B15/08B29C65/76H01M2/0275B32B37/1207B29C66/939B29C66/81457B29C66/91645B29C66/919B29C65/18B29L2009/00B29C66/342B29L2031/3468B32B37/20B32B37/003H01M10/0525B29C66/83415Y02T10/7011B29C66/91421H01M2/0285B29C66/91935B29C66/93B29C66/91431H01M2/0287B29C66/91411B29C66/91445B29C66/93441B29C66/93451B32B7/12B32B15/20B32B27/08B32B27/308B32B27/32B32B27/34B32B27/36B32B2274/00B32B2307/306B32B2307/31B32B2307/514B32B2307/714B32B2457/00B29C66/73711B29C66/45B29C66/71Y10T428/1359Y10T428/31678B29C66/72343B29C66/72341B29C66/1122B29C66/72321Y02E60/10H01M50/124H01M50/133H01M50/121H01M50/129H01M50/119B29C65/40B29C65/20B65D65/40
Inventor 畑浩
Owner 株式会社レゾナックパッケージング
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