Ultrasonic bonding structure for guiding energy, Guiding flow and locating precisely of polymer microstructure
A precise positioning, polymer technology, applied in microstructure technology, microstructure devices, assembling microstructure devices, etc., can solve the problems of large deformation of microchannels, low bonding efficiency of polymer microfluidic chips, etc., to improve friction Surface pressure, improve the production yield, improve the effect of bonding efficiency
Inactive Publication Date: 2010-02-17
DALIAN UNIV OF TECH
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a method for ultrasonically bonding the microstructure of polymer microfluidic chips, which adopts energy guiding and precise positioning of micro-joint structures to realize uniform bonding of ultrasonic sealing surfaces and solve the problem of polymer microfluidic chips. The problems of low bonding efficiency and large deformation of microchannels in fluidic chips
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[0016] The preparation of the microstructure can be obtained by means of hot pressing, injection molding or precision machining. The following describes the embodiments of the present invention in detail by taking hot pressing as an example in combination with the technical scheme and the accompanying drawings.
[0017] Step 1. Preparation of energy-conducting microstructure hot-pressing mold
[0018] Place the wafer in H 2 o 2 :H 2 SO 4 = The 1:3 solution was boiled to smoke for 10 minutes and then rinsed with deionized water for 15 minutes.
[0019] After drying, a hydrophobic surface was obtained; the treated silicon wafer was placed in a ZKLS-2A double-tube diffusion furnace, heated to 1180°C, and kept for 3.5 hours to obtain a silicon dioxide masking film with a thickness of 1 μm on the silicon surface. Coat the BP212 photoresist evenly on the silicon wafer, the pre-spin coating time is 5s, the spin coating time is 30s, the pre-spin coating speed is 500rpm, and the sp...
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Abstract
The ultrasonic bonding structure for polymer microstructure belongs to the field of micro electromechanical polymer system processing technology, and especially the bonding of microflow controlling polymer chip. The microstructure is made through hot pressing in mold, injection molding or precise machining to obtain micro energy guiding beam, micro guide groove and micro locating tongue; and ultrasonic bonding in a plastic welder to seal the micro passage and to obtain the microflow controlling polymer chip. The present invention has high bonding efficiency, high bonding strength and high chipquality.
Description
technical field [0001] The invention belongs to the technical field of polymer micro-electro-mechanical system processing, and relates to a microstructure sealing joint structure, which is used for ultrasonic bonding of polymer microfluidic chip microstructures, and in particular to a polymerization for energy conduction and precise positioning Microstructure ultrasonic bonding structure. Background technique [0002] Microfluidic chips are currently one of the research focuses of micro-total analysis systems (μ-TAS). With the help of micro-fabrication technology, micro-structures mainly composed of micro-pipe networks are produced, and the integration of biological samples is realized through the control of fluids. processing and analysis. Fast and efficient sealing of polymer microchannels is one of the key technologies in chip fabrication. At present, the bonding methods of polymer microfluidic chips can be divided into two categories: interstitial bonding and direct bo...
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IPC IPC(8): B81C99/00B29C65/08
CPCB29C66/30223B29C66/949B29C65/08B81C2203/032B29C66/12463B29C66/939B29C66/3242B29C66/929B81B2203/0338B01L3/502707B29C66/534B81B2201/058B29C66/53461B29C66/322B29L2031/756B01L2300/0877B81C3/001B29C66/54B29C66/73921
Inventor 罗怡王晓东刘冲王立鼎张宗波张振强
Owner DALIAN UNIV OF TECH