Crystal circle marking method, bad grade chip marking method, crystal circle positioning method and crystal circle testing mahcine

Abstract

The invention provides a method for marking a wafer, which comprises providing a wafer having at least two reference marks, wherein a surface of the wafer comprises a plurality of crystal grains, at the same time, detecting the reference marks of the wafer to perform a wafer alignment, and marking the wafer by a laser. In addition, the invention can be suitable for marking the crystal grains of the wafer (for example, throwout crystal grains), comparing to the prior art of marking the throwout crystal grains by ink, has advantages of less wafer pollution, operation time, workshop space and permanent marker, is easier to reconstruct by the existing wafer tester or ink machine platform.

Description

technical field [0001] The invention relates to a method for marking wafers, and in particular to a method for marking defective chips by using laser light. Background technique [0002] The general integrated circuit manufacturing process can be divided into wafer manufacturing stage, chip testing stage, and chip packaging stage in sequence. As current electronic products are thin, light and small, packaging technology at this stage has been gradually developed in order to reduce the packaging volume and improve the performance of integrated circuits. It tends to high-end packaging technologies such as flip-chip packaging and multi-chip modules. However, the cost of these high-end packaging methods is high, so it is best to test the chips before packaging, so that these inferior chips can be removed before the subsequent packaging process. Elimination, saving unnecessary packaging costs. [0003] A wafer-free ink dot test method can generate a wafer image (MAP) after wafer...

AI Technical Summary

Problems solved by technology

[0007] In view of the above problems, an object of the present invention is to solve problems such as the difficulty in controlling the size of ink dots in the existing ink marking process, the easy contamination of wafers, and the long operating time. However, due to the shortening of operating time, the number of machines required It is also reduced, which can effectively save the workshop space

[0009] Another object of the present invention is to propose a method for permanently marking wafers or inferior chips, so as to effectively solve the problem that existing ink marks are easily blurred or difficult to identify due to factors such as the environment or time, so that the wafer must be rinsed And the problem of re-marking process

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