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Composite sheet

A composite sheet and release sheet technology, which is applied in the manufacture of synthetic resin layered products, electrical components, and printed circuits, can solve problems such as poor thermal conductivity, and achieve excellent thermal conductivity and excellent cushioning effects

Inactive Publication Date: 2007-07-25
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the inventors of the present invention have found through studies that the release sheet described in Japanese Patent Application Laid-Open No. 2001-315248 has a problem of poor thermal conductivity.

Method used

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Examples

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Effect test

Embodiment 1

[0029] Silicone gel paste (X-32-2129 manufactured by Shin-Etsu Silicon Co., Ltd.) is applied to a PTFE film after one main surface has been bonded, that is, a bonded PTFE film (No. .901, thickness: 25μm) on the bonded surface. Afterwards, heat at 120° C. for 1 hour to solidify the applied silicone gel paste to form a silicone gel sheet with a thickness of 200 μm to obtain a composite sheet with a total thickness of 225 μm. In this example, the above-mentioned PTFE film corresponds to the release sheet.

Embodiment 2

[0031] In addition to using PTFE-impregnated glass cloth that has been bonded on one main surface, bonded PTFE-impregnated glass cloth (Nitto Denko Co. Except for No. 901 manufactured by Japan Co., Ltd., a composite sheet having a total thickness of 250 μm was obtained in the same manner as in Example 1 above. In this example, the above-mentioned PTFE-impregnated glass cloth corresponds to the release sheet.

Embodiment 3

[0033] Except using the PTFE porous membrane (NTF1026 manufactured by Nitto Denko, thickness: 25 μm) to replace the bonded PTFE membrane (No.901 manufactured by Nitto Denko), all the other operations are the same as in the above-mentioned embodiment 1 to obtain a total thickness of 225 μm. Composite sheet. In this example, the above-mentioned porous PTFE membrane corresponds to a release sheet.

[0034]Any one of the silicone gel sheets in the composite sheets in the above-mentioned Examples 1 to 3 has an adhesive force to glass specified in JIS A5759 within the range of 35 g / cm or more, and the JIS- A hardness is in the range of less than 10. In addition, the penetrations specified in JIS K 2207 are all in the range of 150 to 20 mm / 10.

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Abstract

The invention provides a composite sheet material which contains silicone gel sheet layer and a demould sheet layer arranged on at least one main surface of the silicone gel sheet layer, wherein the demould sheet layer contains fluorine-containing resin and one of the main surface of the demould sheet layer is exposed. According to the invention, a composite sheet material having excellent demolding character, damping character and thermal conductivity can be obtained.

Description

technical field [0001] The present invention relates to a composite sheet used for crimping and bonding of electronic components and the like. Background technique [0002] Due to the automation and speed-up of substrate mounting and wiring connection of electronic components, the development of press-bonding technology using a tape automated bonding (TAB) method is flourishing. As the bonding tape used in the TAB method, there is, for example, an anisotropic conductive film (Anisotropic Conductive Film: ACF). This ACF is often used in the manufacture of flat panel displays (FPDs) such as liquid crystal type, plasma type, and electroluminescent type. For example, in an FPD, it is used for connecting a glass substrate and a driving IC, and for connecting a driving IC and a printed circuit board. [0003] The crimp joining using ACF can be performed as follows. First, as shown in FIG. 2 , an ACF 103 is provided between an electrode 104 provided on a liquid crystal panel 105...

Claims

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Application Information

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IPC IPC(8): B32B9/00B32B27/06B32B25/08H05K3/00
CPCB32B7/06B32B27/08B32B27/283B32B27/322B32B2307/202
Inventor 永山知义高冈诚一
Owner NITTO DENKO CORP
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