Heat conducting polysiloxane composition

A technology of polysiloxane and composition, which is applied in the field of thermally conductive polysiloxane composition, which can solve problems such as heat sinks, heat-generating electronic components, oil spills, etc., and achieve the effect of improving heat resistance and stabilizing the use state

Inactive Publication Date: 2007-07-25
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermally conductive polysiloxane composition will cause oil spillage due to the heating of the silicone oil during long-term use, and it is difficult to directly apply it between the radiator and the heating electronic component

Method used

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  • Heat conducting polysiloxane composition

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Embodiment

[0024] The present invention will be described in more detail below in conjunction with the examples. It should be understood that the present invention should not be considered as limited to these examples.

[0025] Component A:

[0026] Has at least two alkenyl groups in the molecule and a viscosity of 10-100,000mm at 25°C 2 / s organopolysiloxane;

[0027] Component B:

[0028] Organohydrogenpolysiloxanes represented by the following structures:

[0029]

[0030] Component C:

[0031] Aluminum powder with an average particle size of 2 μm;

[0032] Component D:

[0033] Isopropyl triisostearyl titanate.

[0034]When preparing the heat-conducting polysiloxane composition of the present invention, the components A, B, and D are first stirred and mixed at room temperature according to the blending ratio shown in Table 1, so that a certain crosslinking reaction occurs between component A and component B , and then add component C according to the ratio shown in Table 1 ...

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Abstract

This invention discloses a heat-conductive polysiloxane composition, which comprises components A, B, C and D. Component A is organic polysiloxane containing at least two alkenyl groups (viscosity at 25 deg.C is 10-100,000 mm2 / s). Component B is organic hydrogenated polysiloxane containing at least two hydrogen atoms directly bonded to silicon atom. Component C is highly heat-conductive aluminum powder or metal oxide powder filler. Component D is titanate coupling agent or aluminum coupling agent. The heat-conductive polysiloxane composition has such advantages as stable condition and no oil spill.

Description

【Technical field】 [0001] The invention relates to a heat-conducting polysiloxane composition used for heat dissipation of heat-generating electronic components. 【Background technique】 [0002] With the rapid development of the computer industry, more and more heat is released by the heat-generating electronic components. In order to make the heat-generating electronic components operate normally at an appropriate temperature, a heat sink is generally attached to the heat-generating electronic components. To assist heat-generating electronic components to dissipate heat and ensure stable operation of heating-electronic components. [0003] However, the surfaces of general heat sinks and heating electronic components are uneven, resulting in air gaps when the two are attached to each other, and the thermal conductivity of air is very low, generally about 0.025W / (m·℃), which seriously affects overall cooling effect. For this reason, heat dissipation paste and other thermal in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08K5/56C09K5/00
CPCC08L83/04C08G77/20C08G77/12C08L83/00
Inventor 郑景太郑年添
Owner FU ZHUN PRECISION IND SHENZHEN
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