Manufacturing method of semiconductor device

Abstract

A manufacturing method of a semiconductor device including a liquid immersion movement exposure of interposing a liquid between an exposure target substrate and a projection optical system of an exposure apparatus, and carrying out an exposure processing with respect to a plurality of exposure regions set on a surface of the substrate while relatively moving the substrate with respect to the system; a first liquid immersion movement of relatively moving the substrate with respect to the system while interposing the liquid between the substrate and the system and not executing exposure processing, in adjacent exposure regions of said each exposure region; and a second liquid immersion movement of relatively moving the substrate with respect to the system at a speed lower than a movement speed in the first movement, while interposing the liquid between the substrate and the system and not executing the exposure processing, in a distance that is longer than a movement distance in the first movement.

Description

[0001] Cross References to Related Applications [0002] This application is based on and claims priority from Japanese Patent Application No. 2006-012653 filed on January 20, 2006, and the entire content of this original patent application is hereby incorporated by reference. technical field [0003] The present invention relates to exposure technology in photolithography used in the manufacturing process of semiconductor devices, and more particularly to the exposure technology of semiconductor devices in which the exposure process is performed with a liquid interposed between the projection optical system of the exposure device and the substrate to be processed to be exposed. Manufacturing method. Background technique [0004] Recently, an exposure method called a liquid immersion exposure method has attracted attention. In this liquid immersion exposure method, liquid (immersion liquid) is filled between the projection optical system (projection lens) of the exposure de...

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Problems solved by technology

[0008] However, if the stage is simply moved quickly, droplets of the liquid immersion liquid tend to remain on the exposed substrate along the projection optical system of the exposure device and the relative movement track of the liquid immersion liquid with respect to the exposed substrate.

If droplets of the immersion liquid remain on the substrate to be exposed, the resist pattern formed on the resist film deteriorates and defects are likely to occur.

Furthermore, semiconductor devices manufactured based on resist patterns having such defects are more likely to be degraded in performance, quality, or reliability.

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