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Polishing composition

A composition and polymer technology, applied in the direction of polishing composition containing abrasive, grinding device, grinding machine, etc., can solve problems such as hindering disk capacity and excessive grinding

Inactive Publication Date: 2007-08-08
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, when the substrate surface is polished using a conventional polishing composition, the peripheral portion of the substrate surface is excessively polished compared to other surface portions other than the peripheral portion
This hinders the increase of disk capacity

Method used

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no. 1 approach

[0018] The polishing composition according to the first embodiment of the present invention is composed of a compound represented by the following general formula (1), a polishing agent, a polishing accelerator, and water.

[0019]

[0020] In the general formula (1), letter X represents a residue of polyether polyol. Polyether polyols are preferably synthesized from compounds including active hydrogen atoms and alkylene oxides. The polyether chain of the polyether polyol preferably contains 20 to 90% by weight of oxyethylene groups. The letter m is equal to the number of hydroxyl groups in a polyether polyol molecule. Letter m is preferably an integer of 2-8. The letter Y represents a divalent hydrocarbon group. The letter Z denotes the residue of a monovalent compound with an active hydrogen atom. Specific examples of the letters Y and Z are polyaddition polymers formed by addition polymerization of at least one of ethylene oxide and propylene oxide and a lower alcoho...

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Abstract

A polishing composition that prevents a peripheral portion of the surface of a substrate for a magnetic disk from being excessively polished. A first polishing composition according to the present invention includes a compound, which is represented by the following general formula. The letter X represents a residue of polyether polyol. The letter m represents a number equal to the number of hydroxyl groups in one molecule of the polyether polyol. The letter Y represents a divalent hydrocarbon group. The letter Z represents a residue of a monovalent compound, which has an active hydrogen atom. The letter n represents an integer number of at least three. A second polishing composition according to the present invention includes a polymer, which has a monomer unit derived from isoprene sulfonic acid or its salt.

Description

[0001] This application is a divisional application of: [0002] Filing date of original application: May 30, 2003 [0003] Application number of the original application: 03140710.2 [0004] Invention title of the original application: Abrasive composition technical field [0005] The present invention relates to a polishing composition for polishing such as a magnetic disk substrate or the like. Background technique [0006] When a magnetic disk substrate is used to manufacture a magnetic disk, it is common to grind to remove surface undulations of the substrate and to smooth the surface. The surface of the substrate is generally abraded using a polishing composition comprising an abrasive and a polishing accelerator. [0007] However, when the substrate surface is polished using a conventional polishing composition, the peripheral portion of the substrate surface is excessively polished compared to other surface portions other than the peripheral portion. This hinders...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/14B24B37/00C09G1/02C09K3/14G11B5/84
CPCC09G1/02C09K3/1463C09K3/14
Inventor 石桥智明杉山博保大脇寿树
Owner FUJIMI INCORPORATED
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