33results about How to "Avoid over grinding" patented technology

The invention provides a closed loop balance wheel pulse sand making machine and a sand making method. A built-in screen cloth barrel is installed, a side-surface aggregate bin is arranged, two direct-connection and side surface airflows of a pulse fan are used for discharging finished product sand so as to avoid overgrinding, and pulverized particles are controlled. The grinding pressure and the pulverization granularity are regulated by a regulation pressure support frame, a grinder roll spring and a grinder roll spacing device. The dry sand making of mountain rock crushed aggregates and the water-flushing wet type sand making of river sand mud crushed aggregates can be realized by the arrangement of a drop guide and a bottom screen cloth. The practical model machine operation effects are as follows: the size of the feeding crushed aggregates is 10-30mm, the finished product sands of superfine sand, fine sand, medium sand and coarse sand can be generated, and the particle range of the finished product is 0.1-6mm.

Disclosed in the invention is a preparation method for a TEM sample. An inclined cutting opening is formed in a chip sample surface by using an ion beam and level removing and TEM sample preparation are carried out on a target area position directly, so that time for TEM sample preparation is substantially shortened; and the position and depth for level removing are controlled precisely, so that the success rate of sample preparation and the quality of the sample are improved. And the chip sample is protected from being damaged.

The invention relates to a preparation method of spheroidized graphite. A low-specific-surface-area spheroidized graphite production method uses a steam flow pulverizer, and comprises the following steps: primary pulverizing: adding crystalline flake graphite into the steam flow pulverizer for primary pulverizing until the particle size D50 is 20-30 [mu] m, and rotating a pulverizing disc of a main machine clockwise; second-stage crushing: collecting the materials subjected to the first-stage crushing into one piece, uniformly mixing, repeatedly putting into a crushing machine, crushing for 2-6 times, and counterclockwise rotating a crushing disc of a main machine in the even number of times; shaping: the materials subjected to secondary crushing are collected together and mixed, then the materials are repeatedly put into a crusher with set parameters to be crushed and shaped for 8-12 times, and a main machine crushing disc rotates anticlockwise for the even number of times; and grading is conducted, specifically, the shaped coarse powder material is put into the steam flow pulverizer again to be pulverized, shaped and graded, and operation is repeated for 1-3 times till the particle size and the tap density of the generated coarse powder reach target values. The production method gives consideration to tap density and specific surface area.

A polishing composition that prevents a peripheral portion of the surface of a substrate for a magnetic disk from being excessively polished. A first polishing composition according to the present invention includes a compound, which is represented by the following general formula. <EMI ID=1.1 HE=19 WI=96 LX=437 LY=772 TI=CF> <PC>The letter X represents a residue of polyether polyol. The letter m represents a number equal to the number of hydroxyl groups in one molecule of the polyether polyol. The letter Y represents a divalent hydrocarbon group. The letter Z represents a residue of a monovalent compound, which has an active hydrogen atom. The letter n represents an integer number of at least three. A second polishing composition according to the present invention includes a polymer, which has a monomer unit derived from isoprene sulfonic acid or its salt. These polishing compositions also comprise an abrasive, a polishing accelerator and water.

The invention discloses vertical continuous stirring ball-milling equipment which comprises a barrel, a plurality of grinding balls, a barrel cover, a stirrer and an air inlet and outlet control system; the barrel is vertically arranged; the plurality of grinding balls are arranged in the barrel; the barrel cover covers a top opening of the barrel in a sealing manner; the stirrer penetrates through the barrel cover, extends into the barrel and can rotate; materials placed in the barrel are ground by the grinding balls under the rotation of the stirrer; the air inlet and outlet control system comprises an air inlet channel and an air outlet; one end of the air inlet channel is arranged on the bottom surface of the barrel and communicated with the inside of the barrel, and the other end is communicated with a pressurized air tank or an air pump outside the barrel; the air outlet is formed in the barrel cover; the air inlet and outlet control system further comprises a spherical crown type cover plate, and the spherical crown type cover plate is arranged in the barrel, covers a port of the air inlet channel and is connected with the bottom face of the barrel through an elastic piece; and a feeding hole penetrating through the inside and the outside of the barrel is formed in the barrel cover. The vertical continuous stirring ball-milling equipment has the advantages of continuous processing, accurate product particle size control, high efficiency, energy saving and the like.

The invention relates to the field of valve machining, in particular to a valve seat grinding, clamping and moving device. The device comprises a lathe bed, a valve seat clamping mechanism and a valveseat clamping and moving mechanism, wherein the valve seat clamping mechanism comprises a transmission main shaft, a transmission shaft, a clamping mechanism base and a spring; the transmission mainshaft penetrates through the clamping mechanism base, a fixing groove is formed in the transmission main shaft, the transmission shaft is coaxial with the transmission main shaft, and a rectangular linear bearing is arranged between the transmission shaft and the transmission main shaft; the upper end of the transmission shaft is connected with a self-centering chuck; the spring is positioned between the transmission main shaft and the self-centering chuck; the valve seat clamping and moving mechanism comprises a lead screw, and the lead screw penetrates through the clamping mechanism base andthe lathe bed and is in threaded fit with the clamping mechanism base; a guide groove is formed in the lathe bed in the axial direction of the transmission shaft; and the clamping mechanism base is connected with the guide groove in a sliding manner. The valve seat grinding, clamping and moving device disclosed by the invention can drive a valve seat to move, so that the workload of workers is reduced, and the machining efficiency is improved.

The invention relates to a method for reducing the memory effect of chemical mechanical grinding equipment of fixed abrasive particles. The method comprises the following steps of: a) collecting the preset to-be-ground step height Hn of n ground wafers before the next to-be-ground wafer, the actual grinding time Tn, a correction coefficient H0 and a conversion coefficient k; and calculating the average preset to-be-ground step height H and average grinding time T of the ground wafers respectively; and b) calculating a target stepping length IR of the next to-be-ground wafer by a grinding pad according to the following calculation model: IR=k.T(H0+H)/103. The method provided by the invention avoids the conditions of insufficient grinding of the next to-be-ground wafer due to the insufficient abrasive particles on the grinding pad or excessive grinding and waste caused by excessive abrasive particles, and thus reduces the memory effect of chemical mechanical grinding of the fixed abrasive particles, and improves the grinding rate and consistency of wafers with the wafer thickness.

The invention discloses traditional Chinese medicine grinding equipment with adjustable grinding frequency. The traditional Chinese medicine grinding equipment with adjustable grinding frequency comprises a substrate and a placement cavity which is located in the substrate and provided with an upward opening, wherein connection cavities which are located in the left and right sides of the placement cavity and communicate with the placement cavity are formed in the substrate, a clamping device which can clamp a traditional Chinese medicine tank with a to-be-ground traditional Chinese medicine is arranged in the connection cavities and the placement cavity, and the rotating speed of a grinding device can be adjusted by a frequency adjusting device so that the traditional Chinese medicine canbe ground into medicine powder with corresponding particle size according to the practical requirements. The clamping device of the traditional Chinese medicine grinding equipment with adjustable grinding frequency can clamp the grinding tank (traditional Chinese medicine tank) with the traditional Chinese medicine in need of grinding, the grinding tank does not need to be held by people manually, only by clamping the grinding tank into the clamping device and conducting adjustment to obtain required frequency before starting, the traditional Chinese medicine can be automatically ground intothe medicine powder, and the traditional Chinese medicine grinding equipment with adjustable grinding frequency is high in automation degree, and has a timing function, so that overgrinding due to forgetting of a user is prevented.

The invention relates to the technical field of grinding, and discloses a grinding method of a grinding system and the grinding system. The grinding method of the grinding system comprises the following steps that a visual device of the grinding system obtains information of a workpiece so as to obtain a grinding path according to the information of the workpiece; a grinding tool of the grinding system grinds the workpiece along the grinding path, and in the grinding process, the visual device detects the grinding effect of a ground area; and if the grinding effect does not meet the requirement, the grinding system re-plans the grinding path so as to re-grind the area where the grinding effect does not meet the requirement, and grinding force corresponding to the grinding effect is matched for grinding during grinding. By means of the grinding method, the grinding effect of the finally for ground workpiece is good; and during grinding, grinding force corresponding to the grinding effect is matched for grinding, and the over-grinding phenomenon is avoided. The grinding system conducts grinding through the grinding method of the grinding system, and the grinding effect can be guaranteed.

The invention provides a planarization method of an IGBT (Insulated Gate Bipolar Transistor) device. The method comprises the following steps of firstly, removing part of polycrystalline silicon through first grinding to expose a first insulating layer, and then, mainly removing part of the first insulating layer through second grinding to be flush with the upper surface of a second insulating layer, then, polycrystalline silicon on the upper surface of the second insulating layer being mainly removed through third grinding to expose the second insulating layer, that is, targeted grinding being achieved in each grinding process, meanwhile, each grinding process being matched with an online end point detection method to achieve control over each grinding end point, situations of over-polishing and insufficient grinding are avoided, and production efficiency is improved. Therefore, it is guaranteed that the upper surfaces of the first insulating layer and the second insulating layer obtained after planarization processing are flush, and accurate control over the uniformity of the surface morphology of the wafer is achieved.

The invention discloses a low-temperature organic flour processing method. The low-temperature organic flour processing method comprises the three processing steps of checking unprocessed grains, cleaning the unprocessed grains and pulverizing the unprocessed grains; the process of checking the unprocessed grains comprises the sub-step of carrying out conventional check and activity check on the unprocessed grains; the process of cleaning the unprocessed grains comprises the sub-step of removing impurities in the qualified unprocessed grains by using common screening equipment and a special colour selector for wheat; and the process of pulverizing the unprocessed grains comprises the sub-step of grinding and pulverizing the unprocessed grains without impurities in a low-temperature production environment, and finally, packaging prepared flour by using a freshness protection bag. The whole course of the flour processing technology is carried out at low temperature; and furthermore, wheat is prevented from being grinded excessively by extending the length of a flour grinding path, and therefore, the reserving ratio of nutritional ingredients of wheat and the reserving ratio of original wheat flavour of wheat flour are greatly increased.

The photoetching method comprises the following steps: determining whether the position of a defocusing defect on the surface of a wafer is fixed or not according to a defocusing defect pattern; if the position of the defocusing defect is fixed, determining a segmentation layout corresponding to the position of the defocusing defect according to the initial mask plate graph and the defocusing defect graph; adjusting exposure parameters of the segmented layout corresponding to the defocusing defect position; and sequentially exposing the wafer by using all the segmentation layouts. According to the method, the position of the defocus defect is fixed, and the segmentation layout corresponding to the position of the defocus defect is determined by using the initial mask plate graph and the defocus defect graph, so that the exposure parameter of the segmentation layout corresponding to the position of the defocus defect is adjusted; therefore, the position of the mask pattern transferred to the wafer is adjusted in advance in the photoetching process, the problem that a partial region on the wafer is over-ground or insufficiently ground due to a load effect generated on the surface of the wafer when the surface of the wafer is chemically and mechanically ground is avoided, and the yield of a device is improved.

The invention relates to the technical field of rock mechanics, in particular to a dry-type sampling device and method for an easily-hydrolyzed brittle soft rock standard test piece, and the dry-type sampling device comprises a base and a top module which are connected with a processing chamber, a lower rotating module for supporting and fixing the bottom surface of a sample of an octagonal-prism-shaped soft rock block, and a friction assembly arranged on the side surface of the sample, the control assembly is electrically connected with the lower rotating module and the friction assembly and controls the lower rotating module and the friction assembly to move. The characteristics of low hardness and easy polishing of soft rock are utilized, low-strength cutting and polishing are adopted, no cooling water participates in and is not influenced in the whole process, and the defects that a soft rock sample is easy to crack, the physical and mechanical properties of the sample are changed and the like due to stress concentration caused by a traditional sampling method are avoided to the greatest extent; the integrity and the accuracy of physical and mechanical parameters of the soft rock sample are ensured to the greatest extent, and meanwhile, the sampling success rate of on-site rock blocks is improved.

The invention is suitable for the technical field of epoxy resin production, and provides a raw material grinding device for epoxy resin processing. The raw material grinding device comprises a device main body, a grinding cylinder, a grinding assembly and a discharging component, wherein the device main body is provided with a cavity inside; the grinding cylinder is arranged in the device main body in a self-rotating mode, and the grinding cylinder vibrates up and down in the rotating process; discharging holes are formed in the grinding cylinder in an array manner; the discharging holes are used for discharging ground raw materials; the grinding assembly is arranged in the grinding cylinder; the grinding assembly comprises two grinding rollers which are arranged side by side, the two grinding rollers are arranged on a second rotating shaft in a sleeving mode, and the two grinding rollers or one of the two grinding rollers swing along the second rotating shaft in a reciprocating mode along with rotation of the second rotating shaft; and the discharging component is arranged below the device main body and is used for discharging the ground raw materials.