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Composite for grinding

A technology of composition and abrasive, which is applied in the direction of polishing composition containing abrasive, grinding device, grinding machine, etc., and can solve problems such as hindering disk capacity and excessive grinding

Inactive Publication Date: 2003-12-17
FUJIMI INCORPORATED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, when the substrate surface is polished using a conventional polishing composition, the peripheral portion of the substrate surface is excessively polished compared to other surface portions other than the peripheral portion
This hinders the increase of disk capacity

Method used

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  • Composite for grinding
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no. 1 approach

[0013] The polishing composition according to the first embodiment of the present invention is composed of a compound represented by the following general formula (1), a polishing agent, a polishing accelerator, and water.

[0014] In the general formula (1), letter X represents a residue of polyether polyol. Polyether polyols are preferably synthesized from compounds including active hydrogen atoms and alkylene oxides. The polyether chain of the polyether polyol preferably contains 20 to 90% by weight of oxyethylene groups. The letter m is equal to the number of hydroxyl groups in a polyether polyol molecule. Letter m is preferably an integer of 2-8. The letter Y represents a divalent hydrocarbon group. The letter Z denotes the residue of a monovalent compound with an active hydrogen atom. Specific examples of the letters Y and Z are polyaddition polymers formed by addition polymerization of at least one of ethylene oxide and propylene oxide and a lower alcohol or hydro...

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Abstract

A polishing composition that prevents a peripheral portion of the surface of a substrate for a magnetic disk from being excessively polished. A first polishing composition according to the present invention includes a compound, which is represented by the following general formula. <EMI ID=1.1 HE=19 WI=96 LX=437 LY=772 TI=CF> <PC>The letter X represents a residue of polyether polyol. The letter m represents a number equal to the number of hydroxyl groups in one molecule of the polyether polyol. The letter Y represents a divalent hydrocarbon group. The letter Z represents a residue of a monovalent compound, which has an active hydrogen atom. The letter n represents an integer number of at least three. A second polishing composition according to the present invention includes a polymer, which has a monomer unit derived from isoprene sulfonic acid or its salt. These polishing compositions also comprise an abrasive, a polishing accelerator and water.

Description

technical field [0001] The present invention relates to a polishing composition for polishing such as a magnetic disk substrate or the like. Background technique [0002] When a magnetic disk substrate is used to manufacture a magnetic disk, it is common to grind to remove surface undulations of the substrate and to smooth the surface. The surface of the substrate is generally abraded using a polishing composition comprising an abrasive and a polishing accelerator. [0003] However, when the substrate surface is polished using a conventional polishing composition, the peripheral portion of the substrate surface is excessively polished compared to other surface portions other than the peripheral portion. This hinders the increase of disk capacity. Contents of the invention [0004] One of the objects of the present invention is to provide a polishing composition which, when using the polishing composition to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00C09G1/02C09K3/14G11B5/84
CPCC09G1/02C09K3/1463C09K3/14
Inventor 石桥智明杉山博保大脇寿树
Owner FUJIMI INCORPORATED
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