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Process for manufacturing pixel structure of liquid crystal display

A technology of liquid crystal display device and pixel structure, which is applied in semiconductor/solid-state device manufacturing, optics, instruments, etc., and can solve problems such as complex pre-steps

Active Publication Date: 2007-08-08
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the backside exposure process has the advantages of saving processing time and cost, the pre-steps required for the actual application of the backside exposure process of thin film transistors are relatively complicated.
In addition, there are few methods in the industry to effectively form a passivation by using the backside exposure process.

Method used

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  • Process for manufacturing pixel structure of liquid crystal display
  • Process for manufacturing pixel structure of liquid crystal display
  • Process for manufacturing pixel structure of liquid crystal display

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Experimental program
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Embodiment Construction

[0066] Please refer to FIG. 1a to FIG. 1d, which are a series of top views showing the processing flow of the pixel structure of the liquid crystal display device according to a preferred embodiment of the present invention. In addition, please cooperate with FIG. 2a to FIG. 2i to show a series of cross-sectional structural schematic diagrams of the pixel structure of the liquid crystal display device corresponding to the cutting lines A-A', B-B' and C-C' in FIG. 1a to FIG. 1d.

[0067] First, referring to FIG. 1a and FIG. 2a, a substrate 10 is provided, the substrate 10 has a first surface 11 and a second surface 12, and the substrate 10 is formed with a drive unit predetermined area 13, a display area 14, and a capacitor. The predetermined area 15 and the surrounding pad layer area 16 are in contact. 2a is a schematic cross-sectional structural diagram of the A-A', B-B' and C-C' cutting lines in FIG. 1a, which is mainly used to illustrate the formation method of the driving ...

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Abstract

The invention provides a LCD device pixel structure manufacturing method. The LCD device pixel structure manufacturing method includes: provide the substrate, on the substrate forming a drive unit scheduled area and display area; on the drive unit scheduled area of the substrate, forming graphical opaque conductive layer, and simultaneously on the substrate display area forming the translucent pixel electrode; on the substrate, forming the photoresist protection layer; using the back exposure to process graphical photoresist protection layer, to form the graphical photoresist protection layer on the graphical opaque conductive layer, in which the back exposure process uses the opaque graphical pattern conductive layer as a exposure mask; and doing baking process to the photoresist protection layer, making the photoresist protection layer to circumfluence around, so that the photoresist protection layer completely covers the graphical opaque conductive layer. The invention has the effects of simplifying processing, substantially reducing display device production cost and time, and increasing the yield.

Description

technical field [0001] The invention relates to a method for manufacturing a pixel structure of a liquid crystal display device, in particular to a method for manufacturing a pixel structure of a liquid crystal display device using back exposure processing. Background technique [0002] Thin film transistor (thin film transistor, TFT) is an active element (active element) commonly used in active matrix flat panel displays, used to drive active matrix type liquid crystal display (active matrix type liquid crystal display), active organic electroluminescent display (active matrix type organicelectroluminescent display), image detector and other devices. [0003] For example, in the processing of the active drive array of liquid crystal displays, to form a pattern layer, it is necessary to use a yellow light machine to perform alignment, exposure, etc., because the time spent on yellow light exposure and alignment is relatively long. Long, often the bottleneck of the processin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/1362H01L21/84H01L21/31
Inventor 林祥麟
Owner AU OPTRONICS CORP