Chemical mechanical polishing pulp for sapphire substrate underlay
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- 浙江新创纳电子科技有限公司
- Publication Date
- 2007-08-15
Abstract
Description
technical field
[0001] The invention relates to a chemical mechanical polishing slurry, which can be effectively applied to chemical mechanical polishing of sapphire substrates, and belongs to the field of chemical mechanical polishing slurry. Background technique
[0002] Sapphire, also known as white gem, is composed of α-Al 2 o 3 , transparent, has the same optical and mechanical properties as natural gemstones, has good thermal properties, excellent electrical and dielectric properties, and chemical corrosion resistance, high infrared transmittance, good wear resistance, hardness Second only to diamond, it has a Da Mok's grade of 9. It still has good stability at high temperatures. Its melting point is 2030 ° C. It is widely used in industry, national defense, scientific research, civil and other fields. Infrared windows, semiconductor chip substrates, light-emitting diode substrates, precision wear-resistant bearings and other high-tech parts manufacturing materials. ...