Chemical mechanical polishing pulp for sapphire substrate underlay

A chemical-mechanical and polishing slurry technology, used in polishing compositions containing abrasives, stone processing equipment, fine working devices, etc., can solve the problems of low polishing efficiency, large surface roughness, and unmentioned surface quality.
CN101016439AActive Publication Date: 2007-08-15浙江新创纳电子科技有限公司

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
浙江新创纳电子科技有限公司
Publication Date
2007-08-15
Patent Text Reader

Abstract

The invention discloses chemical mechanical polishing liquor for blue stone underlay, which is characterized by the following: this liquor includes pH adjusting agent, surface activator, water medium and compound grinding particle; the compound grinding particle is constructed through coating one deck particle on the surface of base material particle boron carbide. The polishing speed of blue stone underlay can reach 180nm / min and surface coarseness can decrease to below 7.5.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to a chemical mechanical polishing slurry, which can be effectively applied to chemical mechanical polishing of sapphire substrates, and belongs to the field of chemical mechanical polishing slurry. Background technique

[0002] Sapphire, also known as white gem, is composed of α-Al 2 o 3 , transparent, has the same optical and mechanical properties as natural gemstones, has good thermal properties, excellent electrical and dielectric properties, and chemical corrosion resistance, high infrared transmittance, good wear resistance, hardness Second only to diamond, it has a Da Mok's grade of 9. It still has good stability at high temperatures. Its melting point is 2030 ° C. It is widely used in industry, national defense, scientific research, civil and other fields. Infrared windows, semiconductor chip substrates, light-emitting diode substrates, precision wear-resistant bearings and other high-tech parts manufacturing materials. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More