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Chemical mechanical polishing pulp for sapphire substrate underlay

A chemical-mechanical and polishing slurry technology, used in polishing compositions containing abrasives, stone processing equipment, fine working devices, etc., can solve the problems of low polishing efficiency, large surface roughness, and unmentioned surface quality.

Active Publication Date: 2007-08-15
浙江新创纳电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these reports all involve the improvement of the product yield and a better surface, they do not mention the polishing rate, and the surface roughness of the former is still relatively large
In addition, Honglin Zhu et al. mentioned in Applied Surface Science 236 (2004) 120-130 that the use of α-Al 2 o 3 The sapphire is polished under alkaline conditions to obtain an excellent surface. Although the surface roughness is only 0.3nm, the polishing speed is only 1.0mg / h (about 14.8nm / min), and the polishing efficiency is low; Wang Juan et al. used colloidal SiO in "Electronic Technology" 26 (2005) 228-231 2 , after optimizing the process conditions, the polishing rate was increased to 5μm / h (about 83.3nm / min), but the surface quality was not mentioned

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Using the surface coating process of composite abrasive particles, SiO 2 Coating B 4 C is composite abrasive particles:

[0028] The composition of the polishing slurry is as follows:

[0029] Composite abrasive particle content: 5wt%;

[0030] Sodium polyacrylate: 1wt%;

[0031] pH: 3;

[0032] The rest are phosphoric acid and deionized water to adjust the pH value.

[0033] The polishing test results are shown in Table 1.

Embodiment 2

[0035] Using the surface coating process of composite abrasive particles, the α-Al 2 o 3 Coating B 4 C is composite abrasive particles:

[0036] The composition of the polishing slurry is as follows:

[0037] Composite abrasive particle content: 3wt%;

[0038] Sodium polyoxyethylene sulfate: 0.5wt%;

[0039] pH: 5;

[0040] The rest are phosphoric acid and deionized water to adjust the pH value.

[0041] The polishing test results are shown in Table 1.

Embodiment 3

[0043] Using the surface coating process of composite abrasive particles, the γ-Al 2 o 3 Coating B 4 C is composite abrasive particles:

[0044] The composition of the polishing slurry is as follows:

[0045] Composite abrasive particle content: 2wt%;

[0046] Sodium polyoxyethylene sulfate: 0.5wt%;

[0047] pH: 5;

[0048] The rest are phosphoric acid and deionized water to adjust the pH value.

[0049] The polishing test results are shown in Table 1.

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PUM

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Abstract

The invention discloses chemical mechanical polishing liquor for blue stone underlay, which is characterized by the following: this liquor includes pH adjusting agent, surface activator, water medium and compound grinding particle; the compound grinding particle is constructed through coating one deck particle on the surface of base material particle boron carbide. The polishing speed of blue stone underlay can reach 180nm / min and surface coarseness can decrease to below 7.5.

Description

technical field [0001] The invention relates to a chemical mechanical polishing slurry, which can be effectively applied to chemical mechanical polishing of sapphire substrates, and belongs to the field of chemical mechanical polishing slurry. Background technique [0002] Sapphire, also known as white gem, is composed of α-Al 2 o 3 , transparent, has the same optical and mechanical properties as natural gemstones, has good thermal properties, excellent electrical and dielectric properties, and chemical corrosion resistance, high infrared transmittance, good wear resistance, hardness Second only to diamond, it has a Da Mok's grade of 9. It still has good stability at high temperatures. Its melting point is 2030 ° C. It is widely used in industry, national defense, scientific research, civil and other fields. Infrared windows, semiconductor chip substrates, light-emitting diode substrates, precision wear-resistant bearings and other high-tech parts manufacturing materials. ...

Claims

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Application Information

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IPC IPC(8): C09G1/02B28D5/00
Inventor 王良咏张楷亮宋志棠封松林
Owner 浙江新创纳电子科技有限公司
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