Fireproof thermosetting resin composition

A thermosetting resin and thermosetting technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of inability to improve the flame retardant properties of resin compositions and reduce the addition ratio, and achieve excellent flame retardant effects And heat resistance, heat resistance improvement, flame resistance and excellent reliability

Inactive Publication Date: 2007-08-22
CHANG CHUN PLASTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the currently used reactive nitrogen-containing flame retardant resins are developed based on phenolic resins. However, for semiconductor packaging, the resin composition based on phenolic resins is relatively low due to the relatively low proportion of resin added, so that it is impossible to improve the resin combination. flammability

Method used

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  • Fireproof thermosetting resin composition
  • Fireproof thermosetting resin composition
  • Fireproof thermosetting resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0086] [Synthesis example 1] Preparation of titanium compound copolymer complex coated with resin

[0087] Put the titanium compound copolymer complex and epoxy resin or phenolic resin in the ratio of 2:1 by weight in a container, stir thoroughly with a stirrer, and then fully knead with a twin-shaft roller or a twin-shaft extruder at 95°C After that, it is cooled and pulverized to obtain the titanium compound copolymer composite coated with epoxy resin and the titanium compound copolymer composite coated with phenolic resin respectively.

[0088] [Example and Comparative Example]

Embodiment 1

[0089] Example 1 - Preparation of Thermosetting Flame Retardant Epoxy Resin Composition.

[0090] Prepare flame retardant thermosetting epoxy resin composition of the present invention according to the composition listed in Table 1:

[0091] Epoxy resin (a) 15.4 parts by weight

[0092] Hardener (a) 7.80 parts by weight

[0093] Hardening accelerator (a) 0.3 parts by weight

[0094] Titanium compound copolymer complex 5.00 parts by weight

[0095] Silane coupling agent 0.50 parts by weight

[0096] Silicon dioxide 70.00 parts by weight

[0097] Carbon black 0.40 parts by weight

[0098] Carnauba wax 0.60 parts by weight

[0099] The above ingredients are placed in a container, fully stirred by a stirrer, fully kneaded by a 95°C biaxial roller, and then cooled and pulverized to obtain an epoxy resin composition that can be used for semiconductor packaging.

Embodiment 2 to 10 and comparative example 1 to 6

[0101] According to the components and ratios shown in Table 1, the epoxy resin compositions of Examples 2-9 and Comparative Examples 1-5 and the phenolic resin compositions of Example 10 and Comparative Example 6 were prepared in the same manner as described in Example 1.

[0102] Table 1

[0103] implement

Example 2

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Example 6

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Example 7

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Example 8

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Example 9

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Example 10

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Example 6

epoxy resin

a

-

10.8

-

10.2

15.8

15.8

15.8

-

15.8

15.8

15.8

15.8

15.8

-

epoxy resin

b

15.8-

-

-

-

-

-

- ...

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Abstract

The present invention relates to one kind of thermosetting resin composition containing at least one kind of titanium compound-polymer composition serving as the stuffing. The thermosetting resin composition may be used in sealing electromechanical parts, electronic assembly, semiconductor, etc. It has improved fire retarding performance, heat resistance, excellent forming performance and high reliability.

Description

technical field [0001] The present invention relates to a thermosetting resin composition, which contains at least one titanium compound copolymer complex as a filler, and can be used as an encapsulation resin for electromechanical, electronic components, semiconductors, etc., and it is copolymerized by adding the titanium compound The flame retardancy and heat resistance of the compound are improved, and the flame resistance and reliability are excellent, especially resistant to cracks caused by welding, and metal wire corrosion under moisture and high temperature. In addition, UL compliance is achieved without the use of any other flame-resistant materials. Background technique [0002] At present, packaging materials for electromechanical, electronic components, and semiconductor devices are mostly epoxy resin compositions or phenolic resin compositions in view of economic and productivity considerations. These electromechanical, electronic components, and semiconductor ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L63/04C08K5/55C08K3/34C08K3/40C08K7/14C08K3/22H01L21/56
Inventor 黄坤源陈鸿星洪保昇
Owner CHANG CHUN PLASTICS
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