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Excellent antioxidant lead-free solder alloy

A lead-free solder alloy, anti-oxidation technology, applied in the field of solder alloy in the field of soldering technology, can solve the problems of high melting point, poor fluidity, rough surface crystallization of solder joints, etc.

Inactive Publication Date: 2007-09-05
天津市宏远电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in terms of its application characteristics, there are still many unsatisfactory features, such as: poor wettability, high melting point, poor fluidity, and the appearance of solder joints due to Cu 6 sn 5 Phase precipitation, rough surface crystallization of solder joints, poor gloss, solder is easy to form oxide slag, resulting in welding defects (bridging), etc.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] The components and their weight proportions are: Cu: 0.7%; Ni: 0.035%; Ge: 0.01%; Te: 0.01%; the balance is Sn, and the melting temperature is 227°C.

Embodiment 2

[0035] Each component and its weight ratio are: Cu: 0.7%; Ni: 0.035%; Ge: 0.05%; Te: 0.05%; the balance is Sn.

[0036] The lead-free solder alloy provided by the invention improves the melting point of the solder alloy by adding 0.7% Cu. The near-eutectic melting point of 232℃ of pure Sn is lowered to the near-eutectic melting point of Sn-0.7%Cu of 227℃, which improves the strength of lead-free solder alloy; in addition, the addition of Cu can promote the microstructure of solder alloy and inhibit the Welding high temperature Cu dissolution phenomenon. When the weight ratio Cu1%, it will increase the solder liquidus, reduce fluidity, decrease elongation, increase the amount of oxidized slag, and increase the rate of defective welding, which is not conducive to its practical effect. Therefore, the content of Cu in the present invention is controlled at 0.7-0.75%.

[0037] The present invention improves Cu in the solder alloy by adding Ni to the Sn-Cu solder alloy 6 sn 5 Th...

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PUM

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Abstract

A lead-free solder alloy with high antioxidizing performance, flowability and stability, and good surface state contains Cu (0.1-1.0 Wt%), Ni (0.01-0.1), Ge (0.01-0.1), Te (0.01-0.1) and Sn (rest).

Description

technical field [0001] The invention belongs to the solder alloy in the field of soldering technology, in particular to a lead-free solder alloy with excellent oxidation resistance. Background technique [0002] Traditional Sn-Pb solder alloys generally adjust the melting point performance, mechanical properties and physical properties of the solder alloy by adding Pb to the Sn base material, thereby improving the oxidation resistance, fluidity and wettability of the solder alloy during application. wetness. However, Pb itself is a harmful substance. Considering the protection of the working environment and the impact on the global environment when Sn-Pb solder alloys are discarded, the use of Pb-containing solder alloys must be limited. Therefore, research and development of alternative Pb-containing solder alloys is a subject of great concern. The lead-free solder alloy developed must achieve the melting point, fluidity, wettability, oxidation resistance and sufficient s...

Claims

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Application Information

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IPC IPC(8): B23K35/26C22C1/03
Inventor 严健张锡哲邱鹏
Owner 天津市宏远电子有限公司