Polyimide resin, polyimide film, and polyimide laminate
A polyimide resin and film technology, applied in the field of metal-clad laminates, can solve problems such as low water absorption
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Embodiment 1
[0089] A 300 ml five-neck glass round bottom flask equipped with a stainless steel half-moon stirring blade, a nitrogen inlet tube, a Dean-Stark device with a condenser, a thermometer, and a glass three-way valve In a nitrogen atmosphere, 26.00 g (0.06334 moles) of 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP, manufactured by Wakayama Seika Kogyo Co., Ltd.), 0.76 g (0.00704 mol) m-phenylenediamine (MPD, manufactured by Kanto Chemical Co., Ltd.), 51.04 g of γ-butyrolactone (GBL, manufactured by Mitsubishi Chemical Co., Ltd.) as a solvent, and 0.356 g of Tris Ethylamine (TEA, manufactured by Kanto Chemical Co., Ltd.) was stirred at 100 rpm to obtain a solution.
[0090] To this solution, 15.77 grams (0.07037 moles) of 1,2,4,5-cyclohexanetetracarboxylic dianhydride (HPMDA, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and 12.76 grams of dimethylacetamide were added at once. (DMAC, manufactured by Mitsubishi Gas Chemical Co., Ltd.), heated with a mantle heater, and raised ...
Embodiment 2
[0096]In the same five-necked glass round bottom flask used in Example 1, under a nitrogen atmosphere, add 27.280 grams (0.06645 moles) of BAPP, 0.0914 grams (0.00067 moles) of m-xylylenediamine (MXDA, Kanto Chemical Co., Ltd.), 50.00 g of NMP, and 0.34 g of TEA were stirred at 100 rpm to obtain a solution.
[0097] After adding 15.048 grams (0.06713 moles) of HPMDA and 13.63 grams of N-methyl-2-pyrrolidone (NMP, manufactured by Mitsubishi Chemical Co., Ltd.) to the solution at one time, the mantle heater was used to heat. The temperature in the reaction system was increased to 195° C. in 20 minutes. While collecting the distilled components, the temperature in the reaction system was maintained at 195° C. for 12 hours.
[0098] After adding 96.37 g of DMAC, it stirred at about 130 degreeC for about 30 minutes to form a uniform solution, and air-cooled to 100 degreeC for 10 minutes, and obtained the polyimide A solution whose solid content concentration was 20 weight%.
[00...
Embodiment 3
[0102] In addition to using the polyimide A solution obtained in Example 2, a polyimide resin film with a thickness of 25 μm (trade name: Apicar NPI, manufactured by Kaneka Corporation) as an insulating layer, and a polyimide resin film with Rz as a metal layer, A metal foil-clad laminate was obtained in the same manner as in Example 1 except for an electrolytic copper foil having a rough surface of 6.0 μm and a thickness of 18 μm (product name: JTC, manufactured by Nikko Materials Co., Ltd.).
[0103] The peel strength of the metal layer of the obtained metal foil-clad laminate was 0.91 N / mm, and the solder heat resistance was A.
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