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Polyimide resin, polyimide film, and polyimide laminate

A polyimide resin and film technology, applied in the field of metal-clad laminates, can solve problems such as low water absorption

Inactive Publication Date: 2008-01-16
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] The object of the present invention is to solve the problems of the wholly aromatic polyimide resin used in the bonding layer in the past, to provide a polyimide resin with low water absorption and good thermoplasticity, solvent solubility, heat resistance and adhesion and its preparation Method, film containing the polyimide resin, and metal foil-clad laminate containing the adhesive layer formed of the polyimide resin

Method used

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  • Polyimide resin, polyimide film, and polyimide laminate
  • Polyimide resin, polyimide film, and polyimide laminate
  • Polyimide resin, polyimide film, and polyimide laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0089] A 300 ml five-neck glass round bottom flask equipped with a stainless steel half-moon stirring blade, a nitrogen inlet tube, a Dean-Stark device with a condenser, a thermometer, and a glass three-way valve In a nitrogen atmosphere, 26.00 g (0.06334 moles) of 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP, manufactured by Wakayama Seika Kogyo Co., Ltd.), 0.76 g (0.00704 mol) m-phenylenediamine (MPD, manufactured by Kanto Chemical Co., Ltd.), 51.04 g of γ-butyrolactone (GBL, manufactured by Mitsubishi Chemical Co., Ltd.) as a solvent, and 0.356 g of Tris Ethylamine (TEA, manufactured by Kanto Chemical Co., Ltd.) was stirred at 100 rpm to obtain a solution.

[0090] To this solution, 15.77 grams (0.07037 moles) of 1,2,4,5-cyclohexanetetracarboxylic dianhydride (HPMDA, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and 12.76 grams of dimethylacetamide were added at once. (DMAC, manufactured by Mitsubishi Gas Chemical Co., Ltd.), heated with a mantle heater, and raised ...

Embodiment 2

[0096]In the same five-necked glass round bottom flask used in Example 1, under a nitrogen atmosphere, add 27.280 grams (0.06645 moles) of BAPP, 0.0914 grams (0.00067 moles) of m-xylylenediamine (MXDA, Kanto Chemical Co., Ltd.), 50.00 g of NMP, and 0.34 g of TEA were stirred at 100 rpm to obtain a solution.

[0097] After adding 15.048 grams (0.06713 moles) of HPMDA and 13.63 grams of N-methyl-2-pyrrolidone (NMP, manufactured by Mitsubishi Chemical Co., Ltd.) to the solution at one time, the mantle heater was used to heat. The temperature in the reaction system was increased to 195° C. in 20 minutes. While collecting the distilled components, the temperature in the reaction system was maintained at 195° C. for 12 hours.

[0098] After adding 96.37 g of DMAC, it stirred at about 130 degreeC for about 30 minutes to form a uniform solution, and air-cooled to 100 degreeC for 10 minutes, and obtained the polyimide A solution whose solid content concentration was 20 weight%.

[00...

Embodiment 3

[0102] In addition to using the polyimide A solution obtained in Example 2, a polyimide resin film with a thickness of 25 μm (trade name: Apicar NPI, manufactured by Kaneka Corporation) as an insulating layer, and a polyimide resin film with Rz as a metal layer, A metal foil-clad laminate was obtained in the same manner as in Example 1 except for an electrolytic copper foil having a rough surface of 6.0 μm and a thickness of 18 μm (product name: JTC, manufactured by Nikko Materials Co., Ltd.).

[0103] The peel strength of the metal layer of the obtained metal foil-clad laminate was 0.91 N / mm, and the solder heat resistance was A.

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Abstract

Disclosed is a polyimide resin composed of a repeating unit represented by the formula (1) below, or alternatively a repeating unit represented by the formula (1) below and at least one repeating unit represented by the formula (2) below (wherein X is as defined in the description). [Chemical formula 1] [Chemical formula 2] The polyimide resin is good in thermoplasticity, solubility in solvents and heat resistance, while exhibiting low water absorption and excellent adhesiveness. This polyimide resin is useful as a material for the adhesive layer in a metal-clad laminate which includes an insulating base, a metal layer and an adhesive layer arranged between the insulating base and the metal layer.

Description

technical field [0001] The present invention relates to a polyimide resin exhibiting good heat resistance, solvent solubility, thermoplasticity, and low water absorption, the polyimide resin film, and a coating using an adhesive formed of the polyimide resin Metal foil laminate. The metal foil-clad laminate can be processed into printed circuit boards, surface heating elements, electromagnetic wave shielding materials, flat cables, and the like. Background technique [0002] The metal foil-clad laminate can be produced by bonding an insulating base material and a metal layer with an adhesive or an adhesive film. For example, an insulating base material formed of an aromatic polyimide resin film and a metal layer are bonded with an adhesive film to form a three-layer metal foil-clad laminate (see Patent Document 1). [0003] Conventionally, adhesives or adhesive films made of epoxy or acrylic resins have been mainly used as adhesives or adhesive films. However, these resin...

Claims

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Application Information

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IPC IPC(8): C08G73/10B32B15/08
Inventor 美藤毅士木原秀太大石宝雄
Owner MITSUBISHI GAS CHEM CO INC