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Molding composition and method, and molded article

一种组合物、环氧树脂的技术，应用在运输和包装、电固体器件、半导体器件等方向，能够解决降低流动性、增加缺陷、损害可模塑性等问题

Inactive Publication Date: 2008-01-23
GENERAL ELECTRIC CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, higher filler levels reduce flow and impair moldability, thereby exhibiting poor mold filling and increased defect generation

Method used

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  • Molding composition and method, and molded article
  • Molding composition and method, and molded article
  • Molding composition and method, and molded article

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4

[0150] The compositions specified in Table 1 were mixed as described above. Examples 1-3 are comparative examples. The amounts of all components in Table 1 are expressed in parts by weight. Embodiment 4 is an embodiment of the present invention. "Denka FB570 Silica" is a fused silica obtained from Denka, which has a median particle size of 17.7 microns and a surface area of ​​3.1 meters 2 / gram. "Denka SFP Silica" is a fused silica obtained from Denka having a median particle size of 0.7 microns and a surface area of ​​6.2 meters 2 / gram. "Yuka RSS1407LCepoxy" available from Yuka Shell is 3,3',5,5'-tetramethyl-4,4'-diglycidyloxybiphenyl. "Sumitomo ECN-195XL-25" from Sumitomo Chemical is an epoxidized o-cresol novolak resin. "OPPI" is (4-octyloxyphenyl)(phenyl)iodonium hexafluoroantimonate available from GE Advanced Materials-Silicones as UV9392c. "OPPI O3SC4F9" is (4-octyloxyphenyl)(phenyl)iodonium nonafluoro-n-butanesulfonate. It was prepared as follows: 50 g of (4-oc...

Embodiment 5 and 6

[0157] A curable composition was prepared by mixing the materials listed in Table 3 as described above. The amounts of all components in Table 3 are expressed in parts by weight. Example 5 is a comparative example, while Example 6 is an application example of the present invention.

[0158] table 3

[0159] Element

Example 5

Example 6

Denka FB570 Silica

1575

1429.02

Denka SFP Silica

175

158.78

Nippon Kayaku NC-3000 epoxy resin

235.3

212.44

OPPI

2.35

2.12

OPPI O 3 SC 4 f 9

0

1.06

Benpinacol

2.35

2.12

carnauba wax

6.0

5.44

carbon black

4.0

3.63

[0160] The measured characteristic values ​​are shown in Table 4 below. These data again demonstrate that increased helical flow is achieved with mixed catalysts.

[0161] Table 4

[0162] test

Embodiment 7 and 8

[0164] The materials listed in Table 5 were mixed as described above to obtain curable compositions. The amounts of all components in Table 5 are expressed in parts by weight. Embodiment 7 is a comparative example when the amount of filler added is 90%, and Example 8 is an application example of the present invention when the amount of filler added is the same.

[0165] table 5

[0166] Element

Example 7

Example 8

Denka FB570 Silica

1620

1620

Denka SFP Silica

180

180

Yuka RSS 1407LC Epoxy

37.33

37.07

Sumitomo ECN-195XL-25

149.31

148.3

OPPI

2.24

1.85

OPPI O 3 SC 4 f 9

0

0.93

Benpinacol

1.12

1.85

carnauba wax

6.0

6.0

carbon black

4.0

4.0

[0167] The measured characteristic values ​​are shown in Table 6 below. Comparing the helical flow values ​​for Example 5 with a single iodon...

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Abstract

A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (Bl) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B 2a) a diaryl iodonium cation, and (B 2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)metliyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.

Description

Background of the invention [0001] Solid state electronic devices are usually encapsulated in plastic by transfer molding. Encapsulation is used to protect the device from environmental and mechanical damage while electrically insulating the device. Encapsulant compositions need to have many technical properties. The encapsulation process for leaded devices requires the injection of a low viscosity encapsulant, followed by rapid curing and removal of heat. To avoid damage to solid-state devices, the encapsulant must not shrink excessively when cured. The packaged device then has to withstand the rigors of solder assembly to a circuit board. The encapsulant must be self-extinguishing in the event of a thermal failure of the circuit. Also, the encapsulant must adhere firmly to the copper leadframe. [0002] In current epoxy-based potting compositions, it is advantageous to use as much inorganic filler as possible to reduce the hygroscopicity and thermal expansion of the cur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/68
CPCC08G59/68H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/48257H01L2224/73265H01L2224/45144Y10T428/31511H01L2924/00014H01L2924/00H01L2924/00012C08L63/00C08L71/02
Inventor 卢启威迈克尔·奥布赖恩迈克尔·瓦兰斯
Owner GENERAL ELECTRIC CO
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