Optical transducer packaging structure and optical sensing module

A light-sensing module and packaging structure technology, applied in radiation control devices, TVs, color TV components, etc., can solve the problems of glue material flowing to the surface of light-sensing chips, high packaging accuracy requirements, and difficulty in manufacturing. , to avoid overflow to the surface of the light sensor chip, the production yield and quality are stable, and the area and volume are reduced.
CN101132013AInactive Publication Date: 2008-02-27SIGURD MICROELECTRONICS CORP
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
SIGURD MICROELECTRONICS CORP
Publication Date
2008-02-27
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The present invention is an optic-sensor package and an optic-sensing module. The optic-sensing chip is packed by substrate, frames and optic-transparent layer: the frame is set on the substrate and around the optic-sensing chip, and top of the frame extends to the optic-sensing chip and out of a fixing structure of which profile is 'L' type; bending part of the fixing structure forms a container space which can contain and locate the optic-transparent layer. The package has simple structure, is easy to be shaped, and is good for point colloid and sealing. In addition, when the optic-sensor package and lens group are combined into optic-sensing module, smaller size of lens substrate can be used to reduce package area.
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Description

technical field

[0001] The invention relates to a light sensor package structure, in particular to a light sensor package structure and a light sensing module capable of reducing the package area. Background technique

[0002] As shown in FIG. 1 , a traditional CMOS photosensor (CMOS image sensor) packaging structure includes a substrate 10, a frame 20, a light sensing chip 30 and a light-transmitting glass 40. There are several metal wirings 11 on the surface of the substrate 10, and the frame 20 is adhered to On the substrate 10, the adhesive is the first colloid layer 12, and the light sensing chip 30 is adhered on the substrate 10, and the light sensing chip 30 has a light sensing region 31, and the light sensing chip 30 is connected by wire bonding. (Wire bonding) method, using metal wires 32 to connect to the metal wiring 11 on the surface of the substrate 10, so that the light sensing chip 30 can be electrically communicated with the substrate 10, and the light-transm...

Claims

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