Optical transducer packaging structure and optical sensing module

Abstract

The present invention is an optic-sensor package and an optic-sensing module. The optic-sensing chip is packed by substrate, frames and optic-transparent layer: the frame is set on the substrate and around the optic-sensing chip, and top of the frame extends to the optic-sensing chip and out of a fixing structure of which profile is 'L' type; bending part of the fixing structure forms a container space which can contain and locate the optic-transparent layer. The package has simple structure, is easy to be shaped, and is good for point colloid and sealing. In addition, when the optic-sensor package and lens group are combined into optic-sensing module, smaller size of lens substrate can be used to reduce package area.

Description

technical field [0001] The invention relates to a light sensor package structure, in particular to a light sensor package structure and a light sensing module capable of reducing the package area. Background technique [0002] As shown in FIG. 1 , a traditional CMOS photosensor (CMOS image sensor) packaging structure includes a substrate 10, a frame 20, a light sensing chip 30 and a light-transmitting glass 40. There are several metal wirings 11 on the surface of the substrate 10, and the frame 20 is adhered to On the substrate 10, the adhesive is the first colloid layer 12, and the light sensing chip 30 is adhered on the substrate 10, and the light sensing chip 30 has a light sensing region 31, and the light sensing chip 30 is connected by wire bonding. (Wire bonding) method, using metal wires 32 to connect to the metal wiring 11 on the surface of the substrate 10, so that the light sensing chip 30 can be electrically communicated with the substrate 10, and the light-transm...

AI Technical Summary

Problems solved by technology

For example, a packaging process uses the light sensor chip to be mounted on the substrate first, and then the frame is adhered to the substrate to save the size of the structure; however, when assembling with the general lens group, the lens base is still directly installed on the substrate. Outside the frame, its relative volume still cannot be reduced

Alternatively, there is a package structure in which grooves are provided on the inside and outside of the top of the frame to install light-transmitting glass and mirror holders, but the structure of the frame is not easy to manufacture in the injection molding process, and in order to accommodate the mirror holders, It also wastes extra size space around the frame

[0005] Another packaging structure is to extend the top of the frame to the horizontal direction of the photo-sensing chip, and the extended part is designed with two grooves, which are respectively used for the mirror holder and the light-transmitting glass to be placed inside. This packaging structure The assembly size of the lens group can be smaller than the frame size, but its packaging accuracy is high and requires a more sophisticated production machine. In addition, because the position where the light-transmitting glass and the frame groove are connected is very close to the light-sensing chip of the light-sensing chip. area, in the glue dispensing process, it is easy to have doubts that the glue material will flow to the surface of the light sensing chip, which will affect the production yield and quality

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