Method for removing sapphire substrate on blue-light luminescent chip

A technology of sapphire substrate and blue light emission, which is applied in the field of removing the sapphire substrate of blue light emitting chips, can solve problems such as complicated process, decrease of luminous efficiency, heat conduction hindrance, etc., and achieve the goal of improving luminous efficiency, lowering temperature and improving heat dissipation performance Effect

Inactive Publication Date: 2008-04-09
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the low thermal conductivity of sapphire, the conduction of heat is hindered, causing the temperature of the chip to rise, resulting in a decrease in its luminous efficiency
At present, a few companies adopt the meth

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] Embodiment 1: In this example, we take a single light-emitting chip as an example to illustrate how to implement the present invention.

[0013] Specific steps are as follows:

[0014] 1. Pour a 5% sodium hydroxide solution into a petri dish with a flat bottom, and the height of the solution should be controlled below 100 microns;

[0015] 2. Put a chip containing a sapphire substrate into the sodium hydroxide solution, so that a part of the sapphire substrate is immersed in the sodium hydroxide solution, and let it stand for 12 hours, so that most of the sapphire substrate is corroded;

[0016] 3. Rinse the chip with deionized water, put it in an oven, and bake it at 100 degrees Celsius for 1 hour.

Embodiment 2

[0017] Embodiment 2: In this example, we take a wafer containing multiple light-emitting chips as an example to illustrate how to implement the present invention. Specific steps are as follows:

[0018] Pour a 2% sodium hydroxide solution or other alkaline solution that can react with sapphire into a petri dish with a flat bottom. The height of the solution should be controlled below 100 microns;

[0019] Put a wafer containing multiple light-emitting chips into the sodium hydroxide solution, so that a part of the sapphire substrate is immersed in the sodium hydroxide solution, and let stand for 24 hours, so that most of the sapphire substrate is corroded;

[0020] Rinse the chip with deionized water, put it in an oven, and bake it at 100 degrees Celsius for 2 hours.

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PUM

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Abstract

A method of removing blue-ray light-emitting chip sapphire substrate takes the reaction of sodium hydroxide solution or other alkaline solution with the sapphire to corrode the sapphire substrate, then the light-emitting chip without the sapphire substrate or with the sapphire substrate greatly reduced can be obtained after being cleansed by de-ionized water. The technique steps can be shown in details below: firstly, the sodium hydroxide solution or other alkaline solution is poured into a container with a flat bottom, and the height of the solution is controlled below 100 microns, the mass percent concentration of the solution is between 1 percent and 40 percent; secondly, the chip with the sapphire substrate is arranged in the sodium hydroxide solution or other alkaline solution, thereby letting the sapphire substrate partially immerged into the solution for 12 to 24 hours, then the sapphire substrate is corroded away completely or in part; thirdly, the de-ionized water gets utilized to cleanse the chip which is then placed into an oven under 100DEG for an hour or two.

Description

Technical field [0001] The invention relates to a method for removing a sapphire substrate of a blue light emitting chip, in particular to a method for removing a sapphire substrate with poor thermal conductivity to improve the luminous efficiency of the chip by improving the heat dissipation performance of a power blue light emitting chip. Background technique [0002] Semiconductor light-emitting diode is an energy-saving, environmentally friendly, and long-life solid light source. Therefore, the research on semiconductor light-emitting diode technology has been very active in the past ten years. It is hoped that it can replace the currently commonly used fluorescent lamps and incandescent lamps in the future. Many large companies around the world have invested a lot of money to improve the luminous efficiency of high-power semiconductor light-emitting diodes, including chip design, manufacturing process and device packaging technology. For high-power LEDs, good heat dissipatio...

Claims

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Application Information

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IPC IPC(8): C04B41/53
Inventor 娄朝刚张晓兵雷威朱卓娅肖梅王琦龙
Owner SOUTHEAST UNIV
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