Solid-state imaging pickup device, camera, automobile and monitoring device

A technology for a solid-state imaging device and a video camera is applied in the fields of solid-state imaging devices, automobiles, monitoring devices, and cameras, and can solve problems such as difficult quality requirements and increased cost.

Inactive Publication Date: 2008-04-30
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the problem is: it is very difficult to meet such requirements while also meeting quality requirements, and it is inevitable to increase costs

Method used

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  • Solid-state imaging pickup device, camera, automobile and monitoring device
  • Solid-state imaging pickup device, camera, automobile and monitoring device
  • Solid-state imaging pickup device, camera, automobile and monitoring device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0157] FIG. 1 is a block diagram showing the configuration of a camera system in the first embodiment. The camera system in this figure includes n cameras 101 to 10n, a display unit 20 , a display control unit 30 , and a power supply unit 40 . Each camera includes a solid-state imaging element 11 , a drive unit 12 , a signal processing unit 13 , and a determination unit 14 .

[0158] The solid-state imaging element 11 outputs signals of a plurality of pixels according to various driving signals supplied from the driving unit 12 . The signals of the plurality of pixels contain a reference signal with a fixed level, and the reference signal with a fixed level is used for detecting malfunction, that is, for judging a fault. The drive unit 12 drives the solid-state imaging element 11 by outputting various drive signals. The signal processing unit 13 generates an image based on signals of a plurality of pixels output from the solid-state imaging element 11 . The judging unit 14 ...

Embodiment 2

[0180] The configuration of the camera system in this embodiment is almost the same as that in FIG. 1 , except that a solid-state imaging device 21 shown in FIG. 13 is provided instead of the solid-state imaging device 11 . Hereinafter, differences will be described in detail, and descriptions of similarities will be omitted.

[0181] FIG. 13 is a block diagram showing the configuration of the solid-state imaging device 21 in the second embodiment. The solid-state imaging device 11 in this figure differs from the solid-state imaging device 11 shown in FIG. 3 in that a reference signal generating unit 5 is newly added and all pixel units S1 are replaced by pixel units B1.

[0182] The reference signal generating unit 5 injects reference charges corresponding to the reference signal into the uppermost upstream of each vertical transfer unit 2 . Accordingly, the charge injection portion of the pixel portion S1 becomes unnecessary. The reference signal generator 5 has an IS elec...

Embodiment 3

[0187] The configuration of the camera system in this embodiment is almost the same as that in FIG. 1 , except that a solid-state imaging device 31 shown in FIG. 14 is provided instead of the solid-state imaging device 11 . Hereinafter, the description will focus on the points of difference, and the description of the points of similarity will be omitted.

[0188] FIG. 14 is a block diagram showing the configuration of the solid-state imaging device 31 in the third embodiment. The solid-state imaging device 31 in this figure includes: a plurality of photoelectric conversion sections arranged in a matrix, a vertical scanning section 6, a horizontal scanning section 7, and an output amplifier 8, and the vertical scanning section 6 sequentially selects the rows of the photoelectric conversion sections. , the horizontal scanning section 7 sequentially selects the columns of the photoelectric conversion section, the output amplifier 8 outputs signals through the output lines of eac...

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PUM

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Abstract

A solid-state image pickup device is provided with a plurality of photoelectric conversion means for generating a signal corresponding to an incoming light quantity; a plurality of read out means for reading out the signal generated by each of the photoelectric conversion means; a transmission path for transmitting the signal read out by each of the read out means; an output means for outputting each signal transmitted through the transmission path from each of the read out means; and a generating means for generating a constant reference signal. The reference signal is outputted from the output means through at least a part of the transmission path.

Description

technical field [0001] The present invention relates to a solid-state imaging device, a video camera, an automobile, and a monitoring device. outputs signals generated by the respective photoelectric conversion sections; and an output section that outputs signals transmitted by the readout section through the transmission path. Background technique [0002] In recent years, with miniaturization of solid-state imaging devices and increase in the number of pixels, it is necessary to improve reliability while pursuing miniaturization. [0003] As a detection device for detecting the reliability of a solid-state imaging element, for example, the technique disclosed in Patent Document 1 is used. This inspection device inspects each part of a circuit by bringing a probe into contact with a solid-state imaging device on a wafer. [0004] Patent Document 1 Japanese Patent Application Laid-Open No. 2001-8237 [0005] However, for example, when a solid-state imaging device is insta...

Claims

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Application Information

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IPC IPC(8): H04N5/335H04N5/225H04N17/00H01L27/14
Inventor 武田胜见
Owner PANASONIC CORP
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