Unlock instant, AI-driven research and patent intelligence for your innovation.

Circuit base plate and its making method and electronic component using the same

A technology of circuit substrate and manufacturing method, which is applied in the direction of printed circuit manufacturing, printed circuit components, circuits, etc., can solve the problems of low airtightness of through holes 102, difficulty in maintaining airtightness of electronic components, foaming, etc., and achieve airtightness High performance, easy manufacture, and high airtightness

Inactive Publication Date: 2008-05-28
PANASONIC CORP
View PDF1 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, with the conventional method described above, when the filling member 104 is fired, since the adhesive resin contained in the filling member 104 foams, the filling member 104 is made porous.
As a result, the airtightness of the through hole 102 becomes low, so when the circuit board obtained by the above conventional method is used in an electronic component such as a crystal resonator described later, there is a possibility that it may be difficult to maintain the airtightness of the electronic component.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit base plate and its making method and electronic component using the same
  • Circuit base plate and its making method and electronic component using the same
  • Circuit base plate and its making method and electronic component using the same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0044] First, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 referred to is a cross-sectional view of a circuit board according to a first embodiment of the present invention.

[0045] As shown in FIG. 1 , the circuit substrate 1 according to the first embodiment includes: an insulating substrate 10; through holes 11 are formed in the thickness direction of the insulating substrate 10, and are used to connect the first main surface 10a of the insulating substrate 10 and the insulating substrate. The second main surface 10 b of 10 ; the first conductive film 12 ; the second conductive film 13 ; and the filling member 14 are filled in the through hole 11 . Also, the filling member 14 is filled in a non-foamed state. Therefore, the airtightness of the through hole 11 can be improved. In particular, when the porosity of the filling member 14 filled in the through hole 11 is 20% or less (more preferably 10% or less), it is pre...

no. 2 Embodiment approach

[0057] Next, a second embodiment of the present invention will be described with reference to the drawings. FIG. 3 referred to is a cross-sectional view of an electronic component according to a second embodiment of the present invention. The electronic component according to the second embodiment includes the circuit board 1 according to the above-mentioned first embodiment. In addition, in FIG. 3, the same code|symbol is attached|subjected to the same structural element as FIG. 1 sometimes, and the description is abbreviate|omitted.

[0058] As shown in FIG. 3 , the electronic component 2 according to the second embodiment includes: the circuit board 1 according to the above-mentioned first embodiment; an electronic component 20 mounted on the circuit board 1 ; and a cover 21 covering the electronic component 20 . The cover body 21 has a concave portion 21a formed by technical means such as sandblasting or etching. Furthermore, the electronic component 20 is mounted on the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided are a circuit board having a high through hole sealing characteristic, a method for manufacturing such circuit board and an electronic component using such circuit board. The circuit board (1) includes an insulating substrate (10), and a through hole (11) formed in a thickness direction of the insulating substrate (10) for connecting a first main plane (10a) of the insulating substrate (10) with a second main plane (10b) of the insulating substrate (10). The circuit board (1) is characterized in that the board includes a conductive film (12) formed on an inner wall of the through hole (11) and on the circumference of an opening section of the through hole (11) on the first and the second main planes (10a, 10b), and a filling member (14) applied in the through hole (11), and that the filling member (14) is applied in a nonfoamed status.

Description

technical field [0001] The present invention relates to a circuit board on which a chip, a semiconductor element, etc. are mounted, a method for manufacturing the same, and an electronic component using the circuit board. Background technique [0002] As a conventional method of sealing a via hole in a circuit board, there is a method of filling the via hole with glass paste (for example, see Patent Document 1). 5A to 5C are cross-sectional views for explaining the conventional through-hole sealing method described in Patent Document 1. FIG. First, as shown in FIG. 5A , in the thickness direction of the insulating substrate 101 , through-holes 102 are formed by blasting or the like. Next, as shown in FIG. 5B , a conductive film 103 is formed on the inner wall of the via hole 102 and around the opening of the via hole 102 . Then, as shown in FIG. 5C , filling member 104 made of glass paste is filled in through hole 102 and fired to seal through hole 102 . [0003] Patent D...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H01L23/12H03H9/02H03H9/10H05K3/28
CPCH01L21/486H05K3/0094H05K2203/1147H05K2201/0959H01L23/49827H05K3/426H01L23/10H05K1/0306H05K2201/09827H03H9/1021H01L2924/0002Y10T156/1056Y10T428/24612H01L2924/00
Inventor 臼井巧山下薰浅井康夫二川智之
Owner PANASONIC CORP